详解Xilinx公司Zynq® UltraScale+™MPSoC产品

电子工程师 2019-03-05 2936

汽车电子

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描述

Avnet公司的Ultra96 开发板是基于ARM的Xilinx ZynqUltraScale+™ MPSoC系列产品的满足Linaro 96板指标的开发板,设计者可创建或评估Zynq处理器子系统(PS)和可编逻辑(PL)架构,主要用在航空航天与国防,汽车电子,数据中心,无线通信基础设备和无线基础设施.本文介绍了Xilinx公司的Zynq® UltraScale+™MPSoC系列主要特性,应用方案以及AvnetUltra96开发板主要特性,框图,电路图,材料清单和PCB设计图.

Zynq® UltraScale+™ All Programmable MPSoCs provide up to 5X systemlevelperformance-per-watt compared to the Zynq-7000 SoC family.

ZynqUltraScale+ devices combine a high-performance ARM®-basedmulticore,multiprocessing system with ASIC-class programmable logic.

Dual- and quad-core application processor equipped devices delivermaximum scalability, and are capable of offloading critical applications,such as graphics and video pipelining, to dedicated processing blocks,along with a full complement of integrated peripherals and connectivitycores suitable for next-generation systems.

For the most compute intensive processing tasks, integratedprogrammable logic offers up to 100X performance improvement overprocessor-based implementations. The 16nm FinFET+ programmablelogic communicates with the processing system through 6,000 interconnects, enabling bandwidth that is not possible with multichipsolutions. Dramatic power savings are achieved through fine-grainedcontrol of power domains and gated power islands. With specializedprocessing elements for different workloads, ZynqUltraScale+ MPSoCsintegrate the right engines for the right tasks for next-generation
embedded challenges.

Ultra96™ is an Arm-based, Xilinx ZynqUltraScale+™ MPSoC development board based on the Linaro 96Boards specification.

The Zynq® UltraScale+™ MPSoC family is based on the Xilinx® UltraScale™ MPSoC architecture. Thisfamily of products integrates a feature-rich 64-bit quad-core or dual-core ARM® Cortex™-A53 anddual-core ARM Cortex-R5 based processing system (PS) and Xilinx programmable logic (PL)UltraScalearchitecture in a single device. Also included are on-chip memory, multiport external memory interfaces,and a rich set of peripheral connectivity interfaces.

Zynq® UltraScale+™ MPSoC系列主要特性:

Processing System (PS)
ARM Cortex-A53 Based ApplicationProcessing Unit (APU)
• Quad-core or dual-core
• CPU frequency: Up to 1.5GHz
• Extendable cache coherency
• ARMv8-A Architecture
o 64-bit or 32-bit operating modes
oTrustZone security
o A64 instruction set in 64-bit mode,A32/T32 instruction set in 32-bit mode
• NEON Advanced SIMD media-processing engine
• Single/double precision Floating Point Unit (FPU)
• CoreSight™ and Embedded Trace Macrocell (ETM)
• Accelerator Coherency Port (ACP)
• AXI Coherency Extension (ACE)
• Power island gating for each processor core
• Timer and Interrupts
o ARM Generic timers support
o Two system level triple-timer counters
o One watchdog timer
o One global system timer
• Caches
o 32KB Level 1, 2-way set-associativeinstruction cache with parity (independent for
each CPU)
o 32KB Level 1, 4-way set-associative datacache with ECC (independent for each CPU)
o 1MB 16-way set-associative Level 2 cachewith ECC (shared between the CPUs)
Dual-core ARM Cortex-R5 BasedReal-Time Processing Unit (RPU)
• CPU frequency: Up to 600MHz
• ARMv7-R Architecture
o A32/T32 instruction set
• Single/double precision Floating Point Unit (FPU)
• CoreSight™ and Embedded Trace Macrocell(ETM)
• Lock-step or independent operation
• Timer and Interrupts:
o One watchdog timer
o Two triple-timer counters
• Caches and Tightly Coupled Memories (TCMs)
o 32KB Level 1, 4-way set-associativeinstruction and data cache with ECC
(independent for each CPU)
o 128KB TCM with ECC (independent for eachCPU) that can be combined to become 256KBin lockstep mode
On-Chip Memory
• 256KB on-chip RAM (OCM) in PS with ECC
• Up to 36Mb on-chip RAM (UltraRAM) with ECC inPL
• Up to 35Mb on-chip RAM (block RAM) with ECCin PL
• Up to 11Mb on-chip RAM (distributed RAM) in PL
ARM Mali-400 Based GPU
• Supports OpenGL ES 1.1 and 2.0
• Supports OpenVG 1.1
• GPU frequency: Up to 667MHz
• Single Geometry Processor, Two Pixel Processors
• Pixel Fill Rate: 2 Mpixels/sec/MHz
• Triangle Rate: 0.11 Mtriangles/sec/MHz
• 64KB L2 Cache
• Power island gating
External Memory Interfaces
• Multi-protocol dynamic memory controller
• 32-bit or 64-bit interfaces to DDR4, DDR3,DDR3L, or LPDDR3 memories, and 32-bit
interface to LPDDR4 memory
• ECC support in 64-bit and 32-bit modes
• Up to 32GB of address space using single or dualrank of 8-, 16-, or 32-bit-wide memories
• Static memory interfaces
o eMMC4.51 Managed NAND flash support
o ONFI3.1 NAND flash with 24-bit ECC
o 1-bit SPI, 2-bit SPI, 4-bit SPI (Quad-SPI), ortwo Quad-SPI (8-bit) serial NOR flash
8-Channel DMA Controller
• Two DMA controllers of 8-channels each
• Memory-to-memory, memory-to-peripheral,peripheral-to-memory, and scatter-gather transaction support
Serial Transceivers
• Four dedicated PS-GTR receivers andtransmitters supports up to 6.0Gb/s data rates
o Supports SGMII tri-speed Ethernet, PCIExpress® Gen2, Serial-ATA (SATA), USB3.0,and DisplayPort Dedicated I/O Peripherals andInterfaces
• PCI Express — Compliant with PCIe® 2.1 basespecification
o Root complex and End Point configurations
o x1, x2, and x4 at Gen1 or Gen2 rates
• SATA Host
o 1.5, 3.0, and 6.0Gb/s data rates as defined bySATA Specification, revision 3.1
o Supports up to two channels
• DisplayPort Controller
o Up to 5.4Gb/s rate
o Up to two TX lanes (no RX support)
• Four 10/100/1000 tri-speed Ethernet MACperipherals with IEEE Std 802.3 and IEEE Std 1588revision 2.0 support
o Scatter-gather DMA capability
o Recognition of IEEE Std 1588 rev.2 PTP frames
o GMII, RGMII, and SGMII interfaces
o Jumbo frames
• Two USB 3.0/2.0 Device, Host, or OTG peripherals,each supporting up to 12 endpoints
o USB 3.0/2.0 compliant device IP core
o Super-speed, high- speed, full-speed, andlow-speed modes
o Intel XHCI- compliant USB host
• Two full CAN 2.0B-compliant CAN bus interfaces
o CAN 2.0-A and CAN 2.0-B and ISO 118981-1standard compliant
• Two SD/SDIO 2.0/eMMC4.51 compliantcontrollers
• Two full-duplex SPI ports with three peripheralchip selects
• Two high-speed UARTs (up to 1Mb/s)
• Two master and slave I2C interfaces
• Up to 78 flexible multiplexed I/O (MIO) (up tothree banks of 26 I/Os) for peripheral pin
assignment
• Up to 96 EMIOs (up to three banks of 32 I/Os)connected to the PL
Interconnect
• High-bandwidth connectivity within PSand between PS and PL
• ARM AMBA® AXI4-based
• QoS support for latency and bandwidth control
• Cache Coherent Interconnect (CCI)
System Memory Management
• System Memory Management Unit (SMMU)
• Xilinx Memory Protection Unit (XMPU)
Platform Management Unit
• Power gates PS peripherals, power islands, andpower domains
• Clock gates PS peripheral user firmware option
Configuration and Security Unit
• Boots PS and configures PL
• Supports secure and non-secure boot modes
System Monitor in PS
• On-chip voltage and temperature sensing
Programmable Logic (PL)
Configurable Logic Blocks (CLB)
• Look-up tables (LUT)
• Flip-flops
• Cascadable adders
36Kb Block RAM
• True dual-port
• Up to 72 bits wide
• Configurable as dual 18Kb
UltraRAM
• 288Kb dual-port
• 72 bits wide
• Error checking and correction
DSP Blocks
• 27 x 18 signed multiply
• 48-bit adder/accumulator
• 27-bit pre-adder
Programmable I/O Blocks
• Supports LVCMOS, LVDS, and SSTL
• 1.0V to 3.3V I/O
• Programmable I/O delay and SerDes
JTAG Boundary-Scan
• IEEE Std 1149.1 Compatible Test Interface
PCI Express
• Supports Root complex and End Pointconfigurations
• Supports up to Gen4 speeds
• Up to five integrated blocks in select devices
100G Ethernet MAC/PCS
• IEEE Std 802.3 compliant
• CAUI-10 (10x 10.3125Gb/s) or
CAUI-4 (4x 25.78125Gb/s)
• RSFEC (IEEE Std 802.3bj) in CAUI-4 configuration
• Up to four integrated blocks in select devices
Interlaken
• Interlaken spec 1.2 compliant
• 64/67 encoding
• 12 x 12.5Gb/s or 6 x 25Gb/s
• Up to four integrated blocks in select devices
Video Encoder/Decoder (VCU)
• Available in EV devices
• Accessible from either PS or PL
• Simultaneous encode and decode
• H.264 and H.265 support
System Monitor in PL
• On-chip voltage and temperature sensing
• 10-bit 200KSPS ADC with up to 17 external inputs
ZynqUltraScale+ MPSoC: CG器件主要特性:

Xilinx

ZynqUltraScale+ MPSoC: EG器件主要特性:

Xilinx

ZynqUltraScale+ MPSoC: EV器件主要特性:

Xilinx

ZynqUltraScale+ MPSoC系列目标应用:

• Aerospace & Defense
• Automotive
• Data Center
• Wired Communications Infrastructure
• Wireless Infrastructure

应用案例1:

基于照相机的高档辅助驾驶系统(ADAS)

Xilinx

• Quad-core ARM Cortex-A53 for vision analytics, streaming, and automated metadata
• Dual-core ARM Cortex-R5 for real-time peripheral interfaces
• Advanced power management, power islands, and lock-step mode with real-time processing for functional safety
• Video encoder/decoder, supporting H.265/H.264 for display connectivity
• CAN2.0B and Gigabit Ethernet support for IEEE Std 1588 and AVB for in-vehicle communications

应用案例2:

公共安全和军用移动无线电:

Xilinx

• Platform Management Unit (PMU) to dynamically lower power, maximizing battery life
• Quad-core ARM Cortex-A53 to integrate application processing and radio modem
• Vivado HLS and SDx™ Design Environment for high-level (C/C++) waveform development
• W-Mux DSP48 for efficient complex filter implementation
• Processing System (PS) with varying Programmable Logic (PL) for radio scalability with maximum software reuse
• Dedicated configuration security unit (CSU) for security management
Avnet Ultra96™ is an Arm-based, Xilinx ZynqUltraScale+™ MPSoC development board based on the Linaro 96Boards specification.
The Avnet Ultra96 enables hardware and software developers to explore the capabilities of the Zynq® UltraScale+™ MPSoC. Designers can create or evaluate designs for both the Zynq Processor Subsystem (PS) and the Programmable Logic (PL) fabric

图1.Ultra96开发板外形图

Ultra96开发板主要特性:

 ZynqUltraScale+ MPSoC ZU3EG SBVA484
 Memory
oMicron 2 GB (512M x32) LPDDR4 Memory
oMiroSD Socket
§ Ships with Delkin Utility MLC 16GB card
 Wi-Fi / Bluetooth
 DisplayPort
 1x USB 3.0 Type Micro-B upstream port
 2x USB 3.0 Type A downstream ports
 40-pin Low-speed expansion header
 60-pin High speed expansion header
 Mounted on thermal bracket with fan

Xilinx