[组图]集成电路标准封装(p-z开关头)

外形图	封装说明
		TQFP 100L 详细规格
		TSOP Thin Small Outline Package
		TSSOP or TSOP II Thin Shrink Outline Package
		LAMINATE TCSP 20L Chip Scale Package 详细规格
		LAMINATE UCSP 32L Chip Scale Package 详细规格
		uBGA Micro Ball Grid Array
		uBGA Micro Ball Grid Array
		VL Bus VESA Local Bus
		XT Bus 8bit
		ZIP Zig-Zag Inline Package