[组图]集成电路标准封装(a-f开关头)

外形图 封装说明   AC'97 v2.2 specification   AGP 3.3V Accelerated Graphics Port Specification 2.0   AGP PRO Accelerated Graphics Port PRO Specification 1.01   AGP Accelerated Graphics Port Specification 2.0   AMR Audio/Modem Riser   BGA Ball Grid Array   BQFP132   EBGA 680L     LBGA 160L     PBGA 217L Plastic Ball Grid Array   SBGA 192L     TSBGA 680L     C-Bend Lead   CERQUAD Ceramic Quad Flat Pack   CLCC     CNR Communication and Networking Riser Specification Revision 1.2   CPGA Ceramic Pin Grid Array   Ceramic Case   LAMINATE CSP 112L Chip Scale Package   DIP Dual Inline Package   DIP-tab Dual Inline Package with Metal Heatsink   DIMM 168     DIMM DDR     DIMM168 Dual In-line Memory Module   DIMM184 For DDR SDRAM Dual In-line Memory Module   EISA Extended ISA   FBGA   FDIP