[图文]半导体封装及外形尺寸

Subject Case Outline Size (kb) Rev Date TO-204 (TO-3) 1-07 53.0 z 14-NOV-03 TSSOP 1201-01 75.0 a 14-NOV-03 TSSOP 1202-01 83.0 a 14-NOV-03 ChipFET 1206A-03 20.0 null 31-OCT-03 SOT-23 1212-01 30.0 o 14-NOV-03 SOT-89 1213-01 19.0 c 14-NOV-03 SOT-23 1262-01 41.0 a 14-NOV-03 Axial Lead 17-02 25.0 c 29-APR-03 TO-92 (TO-226) 182-06 30.0 l 14-NOV-03 Can Button 193-04 23.0 L 14-NOV-03 Can Button 193A-02 23.0 a 29-APR-03 Microde Axial 194-04 32.0 04H 09-SEP-03 TO-204 (TO-3) 197-02 33.0 j 29-APR-03 TO-204 (TO-3) 197A-05 38.0 K 14-NOV-03 TO-220 221A-07 29.0 aa 21-NOV-03 TO-220 221A-08 30.0 aa 29-APR-03 TO-220 221A-09 29.0 aa 26-NOV-03 TO-220 221B-04 26.0 d 14-NOV-03 TO-220 FULLPAK 221C-02 31.0 d 14-NOV-03 TO-220 FULLPAK 221D-03 21.0 G 14-NOV-03 Axial Lead 267-03 26.0 g 29-APR-03 Axial Lead 267-05 26.0 g 29-APR-03 TO-226 29-05 10.0 AE 14-NOV-03 TO-92 (TO-226) 29-10 30.0 al 14-NOV-03 TO-92 (TO-226) 29-11 22.0 al 24-NOV-03 DO-204 299-02 23.0 a 29-APR-03 TO-220 314A-03 22.0 e 14-NOV-03 TO-220 314B-05 41.0 j 14-NOV-03 TO-220 314D-04 26.0 e 14-NOV-03 null 314E 24.0 null 19-MAR-03 TO-220 314J-01 24.0 o 14-NOV-03 TVA 314K-01 24.0 null 14-NOV-03 TO-220 314N-01 24.0 o 14-NOV-03 SOT-23 (TO-236) 318-08 19.0 null 14-NOV-03 SOT-23 (TO-236) 318-09 19.0 09AH 14-NOV-03 SOT-143 318A 21.0 06T 01-OCT-02 SC-59 318D-04 27.0 f 14-NOV-03 SOT-223 (TO-261) 318E-04 29.0 k 14-NOV-03 SC-74 (SC-59ML) 318F 27.0 null 14-NOV-03 TSOP-6 318G-02 26.0 K 20-NOV-03 SOT-223 318H-01 27.0 o 14-NOV-03 SOT-23L 318J-01 42.0 b 14-NOV-03 SOT-93 (T0-218) 340D-02 21.0 b 14-NOV-03 TO-247 340F-03 33.0 g 14-NOV-03 TO-3PBL (TO-264) 340G-02 24.0 H 14-NOV-03 TO-247 340K-01 33.0 c 14-NOV-03 TO-247 340L-02 24.0 d 14-NOV-03 POWERTAP鈩?II 357C-03 24.0 e 14-NOV-03 POWERTAP鈩?III 357D-01 29.0 a 29-APR-03 DPAK 369-07 29.0 m 14-NOV-03

DPAK 369A-13 21.0 ab 21-NOV-03 DPAK Single Gauge Surface Mount 369C 27.0 null 21-NOV-03 DPAK Single Gauge Insertion Mount 369D 27.0 null 24-NOV-03 SMC 403-03 23.0 b 14-NOV-03 SMB 403A-03 27.0 d 14-NOV-03 SMA 403B-01 28.0 o 14-NOV-03 SMB 403C-01 21.0 o 14-NOV-03 SMA 403D-01 18.0 o 14-NOV-03 SMA 403D-02 19.0 A 14-NOV-03 SC-70 (SOT-323) 419-04 19.0 L 14-NOV-03 SC-88A (SOT-353) 419A-01 22.0 E 14-NOV-03 SC-88A (SOT-353) 419A-02 27.0 G 18-NOV-03 SC-88 (SOT-363) 419B-02 27.0 02T 19-NOV-03 SC-82 419C-01 20.0 a 26-NOV-03 MOSORB 41A-02 24.0 a 29-APR-03 MOSORB 41A-04 17.0 D 29-APR-03 SOD-123 425-04 26.0 c 14-NOV-03 D3PAK 433-01 33.0 d 29-APR-03 POWERMITE 457-04 28.0 d 14-NOV-03 Top Can Button 460-02 23.0 02B 14-NOV-03 SC-75 (SC-90, SOT-416) 463-01 28.0 b 14-NOV-03 SC-89 463C-02 27.0 B 14-NOV-03 SOD-323 477-02 20.0 b 24-NOV-03 SOT-23 / TSOP-5 483 26.0 02C 24-NOV-03 QFN 485AA 26.0 null 11-NOV-03 24 PIN MLF 485F-01 28.0 O 29-APR-03 QFN 3x3 mm, 16 PIN 485G-01 20.0 O 14-NOV-03 QFN 7x7 mm, 32 PIN 485J-02 25.0 0 14-NOV-03 QFN 7x7 mm, 48 PIN 485K-02 26.0 B 14-NOV-03 QFN 4x4 mm, 24 PIN 485L-01 22.0 0 14-NOV-03 null 485M 22.0 01O 25-NOV-03 QFN 3x3x0.9 mm, 12 PIN 485N 18.0 01O 18-NOV-03 QFN 2x2 mm, 6 PIN 488-02 18.0 A 09-SEP-03 FCBGA 489-01 24.0 0 29-APR-03 10 PIN FLIP-Chip 489AA 23.0 01O 26-NOV-03 QSOP-16 492-01 26.0 O 18-NOV-03 QSOP24 492B-01 30.0 0 14-NOV-03 US8 493-01 24.0 O 18-NOV-03 SON-6 494-01 19.0 0 30-OCT-03 POWER QFN 10.5x10.5 mm, FBIP 495-01 26.0 null 16-SEP-03 MicroLeadless 3 PADS 496A 22.0 02A 14-NOV-03 SOD-123FL 498 22.0 1o 14-NOV-03 9 PIN FLIPCHIP CSP 499E 25.0 null 27-NOV-03 POWER QFN 10.5x10.5 mm, JUPITER 500-01 28.0 null 14-NOV-03 QFN 3x3 mm, 10 PIN 501-02 21.0 B 13-NOV-03 LFBGA, 64 BALLS, 7X7 504-01 35.0 null 02-JUL-03 QFN 6x5 mm, DUAL-SIDED, 18 PIN 505 27.0 null 03-NOV-03 QFN 5x6 mm, 8 PIN 505AC 25.0 01O 09-OCT-03 SPAK, 7 Lead 553AA 27.0 null 14-NOV-03 Axial Lead 59-01 23.0 m 29-APR-03

Axial Lead 59-03 24.0 m 25-JUN-03 Axial Lead 59-10 17.0 s 25-JUN-03 Axial Lead (DO-41) 59A-01 23.0 a 29-APR-03 CDIP 620A-01 36.0 o 29-APR-03 PDIP 626-05 26.0 l 27-NOV-03 PDIP 7 (Minus Pin #6) 626A-01 27.0 0 14-NOV-03 PDIP 7 (Minus Pin #7) 626B 32.0 01A 14-NOV-03 CDIP 632-08 37.0 y 29-APR-03 PDIP 646-06 36.0 m 27-NOV-03 PDIP 648-08 35.0 r 20-NOV-03 PDIP 648C-04 41.0 d 14-NOV-03 PDIP 648E-01 41.0 o 14-NOV-03 PDIP 707-02 26.0 d 14-NOV-03 PDIP 709-02 25.0 d 14-NOV-03 PDIP 711-03 28.0 d 14-NOV-03 PDIP 724-03 38.0 d 14-NOV-03 CDIP 732-03 35.0 e 29-APR-03 PDIP 738-03 36.0 e 14-NOV-03 SOIC 751-06 38.0 null 27-NOV-03 SOIC 751-07 28.0 AA 25-NOV-03 SOIC 751A-03 38.0 f 27-NOV-03 SOIC 751B-05 41.0 j 25-NOV-03 SOIC 751D-05 44.0 f 26-NOV-03 SOIC 751E-04 40.0 e 14-NOV-03 SOIC 751F-05 31.0 g 14-NOV-03 SOIC 751G-03 39.0 b 26-NOV-03 SO-16 751K-01 24.0 o 14-NOV-03 SOIC-16WB 751N-01 15.0 null 14-NOV-03 SOIC 751P-01 34.0 o 14-NOV-03 SOIC 16 Lead Wide Body Exposed Pad 751R-02 25.0 02A 24-NOV-03 CDIP 758-02 33.0 a 29-APR-03 TO-225 77-09 27.0 w 29-APR-03 PLCC 775-02 31.0 d 14-NOV-03 PLCC 776-02 34.0 e 14-NOV-03 PLCC 777-02 42.0 d 14-NOV-03 null 778B-01 36.0 o 14-NOV-03 PDIP 804-01 41.0 a 14-NOV-03 TO-220 821E-04 24.0 c 14-NOV-03 TO-220 821H-02 24.0 a 14-NOV-03 TO-220 821J-02 26.0 a 14-NOV-03 TO-220 821P 22.0 3 14-NOV-03 Micro8ℿ/TD> 846A-02 25.0 E 14-NOV-03 Micro-10 846B-02 22.0 2 14-NOV-03 MICRO-8 LEADLESS 846C-01 23.0 o 14-NOV-03 64 Lead Exposed Pad LQFP 848G 46.0 02A 14-MAR-03 LQFP 52 LEAD EXPOSED PAD 848H-01 43.0 01O 17-JUL-03 LQFP 873A-02 63.0 a 24-NOV-03 LQFP 48 Leads 932AA 43.0 01O 29-OCT-03 D2PAK 936-03 36.0 b 21-NOV-03 D2PAK 936D-03 15.0 2 29-APR-03

PowerFLEX ℿ/TD> 936J-01 27.0 o 29-APR-03 SOIC EIAJ 940A-03 28.0 d 29-APR-03 SSOP 940B-03 28.0 d 23-JUN-03 SSOP 940C-03 44.0 b 29-APR-03 SSOP 940D-03 30.0 d 29-APR-03 TSSOP 948E-02 45.0 a 25-NOV-03 TSSOP 948F-01 47.0 o 18-NOV-03 TSSOP 948G-01 44.0 o 14-NOV-03 24 LEAD TSSOP 948H-01 30.0 A 21-NOV-03 TSSOP 948J-01 29.0 o 14-NOV-03 TSSOP 948K-01 51.0 o 09-OCT-03 TSSOP 8 948R-02 41.0 a 14-NOV-03 TSSOP 8 948S-01 49.0 o 14-NOV-03 SOEIAJ-14 965-01 27.0 0 26-NOV-03 SOEIAJ-16 966-01 27.0 o 26-NOV-03 SOEIAJ-20 967-01 28.0 o 26-NOV-03 SOEIAJ-8 968-01 23.0 o 29-APR-03