一、综合词汇
1、印制电路：printedcircuit
2、印制线路：printedwiring
3、印制板：printedboard
4、印制板电路：printedcircuitboard(PCB)
5、印制线路板：printedwiringboard(PWB)
6、印制元件：printedcomponent
7、印制接点：printedcontact
8、印制板装配：printedboardassembly
9、板：board
10、单面印制板：single-sidedprintedboard(SSB)
11、双面印制板：double-sidedprintedboard(DSB)
12、多层印制板：mulitlayerprintedboard(MLB)
13、多层印制电路板：mulitlayerprintedcircuitboard
14、多层印制线路板：mulitlayerpritedwiringboard
15、刚性印制板：rigidprintedboard
16、刚性单面印制板：rigidsingle-sidedprintedborad
17、刚性双面印制板：rigiddouble-sidedprintedborad
18、刚性多层印制板：rigidmultilayerprintedboard
19、挠性多层印制板：flexiblemultilayerprintedboard
20、挠性印制板：flexibleprintedboard
21、挠性单面印制板：flexiblesingle-sidedprintedboard
22、挠性双面印制板：flexibledouble-sidedprintedboard
23、挠性印制电路：flexibleprintedcircuit(FPC)
24、挠性印制线路：flexibleprintedwiring
25、刚性印制板：flex-rigidprintedboard,rigid-flexprintedboard
26、刚性双面印制板：flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted
27、刚性多层印制板：flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard
28、齐平印制板：flushprintedboard
29、金属芯印制板：metalcoreprintedboard
30、金属基印制板：metalbaseprintedboard
31、多重布线印制板：mulit-wiringprintedboard
32、陶瓷印制板：ceramicsubstrateprintedboard
33、导电胶印制板：electroconductivepasteprintedboard
34、模塑电路板：moldedcircuitboard
35、模压印制板：stampedprintedwiringboard
36、顺序层压多层印制板：sequentially-laminatedmulitlayer
37、散线印制板：discretewiringboard
38、微线印制板：microwireboard
39、积层印制板：buile-upprintedboard
40、积层多层印制板：build-upmulitlayerprintedboard(BUM)
41、积层挠印制板：build-upflexibleprintedboard
42、表面层合电路板：surfacelaminarcircuit(SLC)
43、埋入凸块连印制板：B2itprintedboard
44、多层膜基板：multi-layeredfilmsubstrate(MFS)
45、层间全内导通多层印制板：ALIVHmultilayerprintedboard
46、载芯片板：chiponboard(COB)
47、埋电阻板：buriedresistanceboard
48、母板：motherboard
49、子板：daughterboard
50、背板：backplane
51、裸板：bareboard
52、键盘板夹心板：copper-invar-copperboard
53、动态挠性板：dynamicflexboard
54、静态挠性板：staticflexboard
55、可断拼板：break-awayplanel
56、电缆：cable
57、挠性扁平电缆：flexibleflatcable(FFC)
58、薄膜开关：membraneswitch
59、混合电路：hybridcircuit
60、厚膜：thickfilm
61、厚膜电路：thickfilmcircuit
62、薄膜：thinfilm
63、薄膜混合电路：thinfilmhybridcircuit
64、互连：interconnection
65、导线：conductortraceline
66、齐平导线：flushconductor
67、传输线：transmissionline
68、跨交：crossover
69、板边插头：edge-boardcontact
70、增强板：stiffener
71、基底：substrate
72、基板面：realestate
73、导线面：conductorside
74、元件面：componentside
75、焊接面：solderside
76、印制：printing
77、网格：grid
78、图形：pattern
79、导电图形：conductivepattern
80、非导电图形：non-conductivepattern
81、字符：legend
82、标志：mark
二、基材：
1、基材：basematerial
2、层压板：laminate
3、覆金属箔基材：metal-cladbadematerial
4、覆铜箔层压板：copper-cladlaminate(CCL)
5、单面覆铜箔层压板：single-sidedcopper-cladlaminate
6、双面覆铜箔层压板：double-sidedcopper-cladlaminate
7、复合层压板：compositelaminate
8、薄层压板：thinlaminate
9、金属芯覆铜箔层压板：metalcorecopper-cladlaminate
10、金属基覆铜层压板：metalbasecopper-cladlaminate
11、挠性覆铜箔绝缘薄膜：flexiblecopper-claddielectricfilm
12、基体材料：basismaterial
13、预浸材料：prepreg
14、粘结片：bondingsheet
15、预浸粘结片：preimpregnatedbondingsheer
16、环氧玻璃基板：epoxyglasssubstrate
17、加成法用层压板：laminateforadditiveprocess
18、预制内层覆箔板：masslaminationpanel
19、内层芯板：corematerial
20、催化板材：catalyzedboard,coatedcatalyzedlaminate
21、涂胶催化层压板：adhesive-coatedcatalyzedlaminate
22、涂胶无催层压板：adhesive-coateduncatalyzedlaminate
23、粘结层：bondinglayer
24、粘结膜：filmadhesive
25、涂胶粘剂绝缘薄膜：adhesivecoateddielectricfilm
26、无支撑胶粘剂膜：unsupportedadhesivefilm
27、覆盖层：coverlayer(coverlay)
28、增强板材：stiffenermaterial
29、铜箔面：copper-cladsurface
30、去铜箔面：foilremovalsurface
31、层压板面：uncladlaminatesurface
32、基膜面：basefilmsurface
33、胶粘剂面：adhesivefaec
34、原始光洁面：platefinish
35、粗面：mattfinish
36、纵向：lengthwisedirection
37、模向：crosswisedirection
38、剪切板：cuttosizepanel
39、酚醛纸质覆铜箔板：phenoliccellulosepapercopper-cladlaminates(phenolic/paperCCL)
40、环氧纸质覆铜箔板：epoxidecellulosepapercopper-cladlaminates(epoxy/paperCCL)
41、环氧玻璃布基覆铜箔板：epoxidewovenglassfabriccopper-cladlaminates
42、环氧玻璃布纸复合覆铜箔板：epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates
43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates
44、聚酯玻璃布覆铜箔板：ployesterwovenglassfabriccopper-cladlaminates
45、聚酰亚胺玻璃布覆铜箔板：polyimidewovenglassfabriccopper-cladlaminates
46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxidewovenglassfabriccopper-cladlamimates
47、环氧合成纤维布覆铜箔板：epoxidesyntheticfiberfabriccopper-cladlaminates
48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiberglasscopper-cladlaminates
49、超薄型层压板：ultrathinlaminate
50、陶瓷基覆铜箔板：ceramicsbasecopper-cladlaminates
51、紫外线阻挡型覆铜箔板：UVblockingcopper-cladlaminates
三、基材的材料
1、A阶树脂：A-stageresin
2、B阶树脂：B-stageresin
3、C阶树脂：C-stageresin
4、环氧树脂：epoxyresin
5、酚醛树脂：phenolicresin
6、聚酯树脂：polyesterresin
7、聚酰亚胺树脂：polyimideresin
8、双马来酰亚胺三嗪树脂：bismaleimide-triazineresin
9、丙烯酸树脂：acrylicresin
10、三聚氰胺甲醛树脂：melamineformaldehyderesin
11、多官能环氧树脂：polyfunctionalepoxyresin
12、溴化环氧树脂：brominatedepoxyresin
13、环氧酚醛：epoxynovolac
14、氟树脂：fluroresin
15、硅树脂：siliconeresin
16、硅烷：silane
17、聚合物：polymer
18、无定形聚合物：amorphouspolymer
19、结晶现象：crystallinepolamer
20、双晶现象：dimorphism
21、共聚物：copolymer
22、合成树脂：synthetic
23、热固性树脂：thermosettingresin
24、热塑性树脂：thermoplasticresin
25、感光性树脂：photosensitiveresin
26、环氧当量：weightperepoxyequivalent(WPE)
27、环氧值：epoxyvalue
28、双氰胺：dicyandiamide
29、粘结剂：binder
30、胶粘剂：adesive
31、固化剂：curingagent
32、阻燃剂：flameretardant
33、遮光剂：opaquer
34、增塑剂：plasticizers
35、不饱和聚酯：unsatuiatedpolyester
36、聚酯薄膜：polyester
37、聚酰亚胺薄膜：polyimidefilm(PI)
38、聚四氟乙烯：polytetrafluoetylene(PTFE)
39、聚全氟乙烯丙烯薄膜：perfluorinatedethylene-propylenecopolymerfilm(FEP)
40、增强材料：reinforcingmaterial
41、玻璃纤维：glassfiber
42、E玻璃纤维：E-glassfibre
43、D玻璃纤维：D-glassfibre
44、S玻璃纤维：S-glassfibre
45、玻璃布：glassfabric
46、非织布：non-wovenfabric
47、玻璃纤维垫：glassmats
48、纱线：yarn
49、单丝：filament
50、绞股：strand
51、纬纱：weftyarn
52、经纱：warpyarn
53、但尼尔：denier
54、经向：warp-wise
55、纬向：weft-wise,filling-wise
56、织物经纬密度：threadcount
57、织物组织：weavestructure
58、平纹组织：plainstructure
59、坏布：greyfabric
60、稀松织物：wovenscrim
61、弓纬：bowofweave
62、断经：endmissing
63、缺纬：mis-picks
64、纬斜：bias
65、折痕：crease
66、云织：waviness
67、鱼眼：fisheye
68、毛圈长：featherlength
69、厚薄段：mark
70、裂缝：split
71、捻度：twistofyarn
72、浸润剂含量：sizecontent
73、浸润剂残留量：sizeresidue
74、处理剂含量：finishlevel
75、浸润剂：size
76、偶联剂：couplintagent
77、处理织物：finishedfabric
78、聚酰胺纤维：polyarmidefiber
79、聚酯纤维非织布：non-wovenpolyesterfabric
80、浸渍绝缘纵纸：impregnatinginsulationpaper
81、聚芳酰胺纤维纸：aromaticpolyamidepaper
82、断裂长：breakinglength
83、吸水高度：heightofcapillaryrise
84、湿强度保留率：wetstrengthretention
85、白度：whitenness
86、陶瓷：ceramics
87、导电箔：conductivefoil
88、铜箔：copperfoil
89、电解铜箔：electrodepositedcopperfoil(EDcopperfoil)
90、压延铜箔：rolledcopperfoil
91、退火铜箔：annealedcopperfoil
92、压延退火铜箔：rolledannealedcopperfoil(RAcopperfoil)
93、薄铜箔：thincopperfoil
94、涂胶铜箔：adhesivecoatedfoil
95、涂胶脂铜箔：resincoatedcopperfoil(RCC)
96、复合金属箔：compositemetallicmaterial
97、载体箔：carrierfoil
98、殷瓦：invar
99、箔（剖面）轮廓：foilprofile
100、光面：shinyside
101、粗糙面：matteside
102、处理面：treatedside
103、防锈处理：stainproofing
104、双面处理铜箔：doubletreatedfoil
四、设计
1、原理图：shematicdiagram
2、逻辑图：logicdiagram
3、印制线路布设：printedwirelayout
4、布设总图：masterdrawing
5、可制造性设计：design-for-manufacturability
6、计算机辅助设计：computer-aideddesign.(CAD)
7、计算机辅助制造：computer-aidedmanufacturing.(CAM)
8、计算机集成制造：computerintegratmanufacturing.(CIM)
9、计算机辅助工程：computer-aidedengineering.(CAE)
10、计算机辅助测试：computer-aidedtest.(CAT)
11、电子设计自动化：electricdesignautomation.(EDA)
12、工程设计自动化：engineeringdesignautomaton.(EDA2)
13、组装设计自动化：assemblyaidedarchitecturaldesign.(AAAD)
14、计算机辅助制图：computeraideddrawing
15、计算机控制显示：computercontrolleddisplay.(CCD)
16、布局：placement
17、布线：routing
18、布图设计：layout
19、重布：rerouting
20、模拟：simulation
21、逻辑模拟：logicsimulation
22、电路模拟：circitsimulation
23、时序模拟：timingsimulation
24、模块化：modularization
25、布线完成率：layouteffeciency
26、机器描述格式：machinedescriptionmformat.(MDF)
27、机器描述格式数据库：MDFdatabse
28、设计数据库：designdatabase
29、设计原点：designorigin
30、优化（设计）：optimization(design)
31、供设计优化坐标轴：predominantaxis
32、表格原点：tableorigin
33、镜像：mirroring
34、驱动文件：drivefile
35、中间文件：intermediatefile
36、制造文件：manufacturingdocumentation
37、队列支撑数据库：queuesupportdatabase
38、元件安置：componentpositioning
39、图形显示：graphicsdispaly
40、比例因子：scalingfactor
41、扫描填充：scanfilling
42、矩形填充：rectanglefilling
43、填充域：regionfilling
44、实体设计：physicaldesign
45、逻辑设计：logicdesign
46、逻辑电路：logiccircuit
47、层次设计：hierarchicaldesign
48、自顶向下设计：top-downdesign
49、自底向上设计：bottom-updesign
50、线网：net
51、数字化：digitzing
52、设计规则检查：designrulechecking
53、走（布）线器：router(CAD)
54、网络表：netlist
55、计算机辅助电路分析：computer-aidedcircuitanalysis
56、子线网：subnet
57、目标函数：objectivefunction
58、设计后处理：postdesignprocessing(PDP)
59、交互式制图设计：interactivedrawingdesign
60、费用矩阵：costmetrix
61、工程图：engineeringdrawing
62、方块框图：blockdiagram
63、迷宫：moze
64、元件密度：componentdensity
65、巡回售货员问题：travelingsalesmanproblem
66、自由度：degreesfreedom
67、入度：outgoingdegree
68、出度：incomingdegree
69、曼哈顿距离：manhattondistance
70、欧几里德距离：euclideandistance
71、网络：network
72、阵列：array
73、段：segment
74、逻辑：logic
75、逻辑设计自动化：logicdesignautomation
76、分线：separatedtime
77、分层：separatedlayer
78、定顺序：definitesequence
五、形状与尺寸：
1、导线（通道）：conduction(track)
2、导线（体）宽度：conductorwidth
3、导线距离：conductorspacing
4、导线层：conductorlayer
5、导线宽度/间距：conductorline/space
6、第一导线层：conductorlayerNo.1
7、圆形盘：roundpad
8、方形盘：squarepad
9、菱形盘：diamondpad
10、长方形焊盘：oblongpad
11、子弹形盘：bulletpad
12、泪滴盘：teardroppad
13、雪人盘：snowmanpad
14、V形盘：V-shapedpad
15、环形盘：annularpad
16、非圆形盘：non-circularpad
17、隔离盘：isolationpad
18、非功能连接盘：monfunctionalpad
19、偏置连接盘：offsetland
20、腹（背）裸盘：back-bardland
21、盘址：anchoringspaur
22、连接盘图形：landpattern
23、连接盘网格阵列：landgridarray
24、孔环：annularring
25、元件孔：componenthole
26、安装孔：mountinghole
27、支撑孔：supportedhole
28、非支撑孔：unsupportedhole
29、导通孔：via
30、镀通孔：platedthroughhole(PTH)
31、余隙孔：accesshole
32、盲孔：blindvia(hole)
33、埋孔：buriedviahole
34、埋/盲孔：buried/blindvia
35、任意层内部导通孔：anylayerinnerviahole(ALIVH)
36、全部钻孔：alldrilledhole
37、定位孔：toalinghole
38、无连接盘孔：landlesshole
39、中间孔：interstitialhole
40、无连接盘导通孔：landlessviahole
41、引导孔：pilothole
42、端接全隙孔：terminalclearomeehole
43、准表面间镀覆孔：quasi-interfacingplated-throughhole
44、准尺寸孔：dimensionedhole
45、在连接盘中导通孔：via-in-pad
46、孔位：holelocation
47、孔密度：holedensity
48、孔图：holepattern
49、钻孔图：drilldrawing
50、装配图：assemblydrawing
51、印制板组装图：printedboardassemblydrawing
52、参考基准：datumreference
