信步科技SV-33A66嵌入式主板介绍

描述

ARM Rockchip RK3399 CPU, 6*COM, 7*USB, 1*LAN, 1*Mini-PCIe, 2*Touch Panel, WIFI+BT on board

  • ARM Rockchip RK3399 CPU
  • 1/2/4G RAM on board, 8/16/32G EMMC
  • 6*COM, 7*USB, 1*1000Mbps LAN
  • Provide 1*HDMI, 1*eDP, 1*LVDS/eDP, 2*Touch Panel Header
  • 1*Mini-PCIe (Supports Wifi/3G/4G), WIFI+BT on board

规格

General 
CPU

ARMRockchip® RK3399, Dual-Core Cortex-A72 + Quad-Core Cortex-A53,

up to 1.8GHz and1.4GHz
Chipset Null
Memory DDR3-1333, 1/2/4GB, on board
Storage 1*eMMC 8/16/32G, 1*TF Card
Expansion Interface 1*Mini-PCIe (Wifi/3G/4G Supported)
BIOS Null
System Android 4.4/5.1/7.1
I/O Interface
Serial Port 6*RS232 (COM1 RS485 optional)
USB 1*USB 3.0, 6*USB 2.0
Ethernet

1*Realtek® 1Gbps PCIe Ethernet Controller, RJ45

1*RealtekWIFI+BT module on board

(Wifi IEEE 802.11a/b/g/n/ac, 2.4GHz/5GHz, BT 4.2 support BLE)
Audio Everest® Codec, with MIC/Line-out and Amplifier
PS/2 Null
Parallel Port Null
GPIO 8 programmable GPIO
Feature Interface

2*TouchPanel Header (USB only)

1*Infrared Header
Display 
Display Interface

1*HDMI: max resolution up to 4096*2160@60Hz

1*eDP: max resolution up to 4096*2160@30Hz

1*LVDS/eDP: LVDS, Dual Channel 24 bit,resolution up to 1920*1080@60Hz

                   eDP, resolution up to 4096*2160@30Hz
Multiple Display Dual
Mechanical & Environment   
Dimension 146*105mm
Power Input DC 12V
Temperature Operation: 0℃~60℃, Storage: -25℃~75℃
Relative Humidity Operation: 10%~90%, Storage: 5%~95%, non-condensing
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