信步科技SV1-H2726C规格英文版

描述

Intel® Kaby Lake 7th Gen Core i3/i5/i7 CPU (LGA1151) with H270, Double-layer Rear I/O which can expand to 18*COM and 18*USB

  • Supports Intel® Kaby Lake 7th Gen Core i3/i5/i7 CPU (LGA1151) with Intel H270 chipset
  • Double-layer Rear I/O which can expand to 18*COM and 18*USB (use SV-M5 I/O Extension Modules)
  • Supports dual display of VGA and HDMI
  • 2*1000 Mbps LAN and 1*PCI-E 16X
  • 2*Mini-PCIe (Supports 1*mSATA, 1*Wifi+3G/4G)

规格

General
CPU Intel® Kaby Lake Pentium®/ Celeron®/ 7th Generation CoreTM i3/i5/i7 CPU, LGA1151
Chipset Intel® H270 Chipset, TDP 6W
Memory Up to 32 GB DDR4 2133/1866 MHz, 2*DIMM
Storage 2*SATA 3.0, 1*mSATA
Expansion Interface 1*PCI-E 16X, 2*Mini-PCIe(1*mSATA Supported, 1*Wifi/3G/4G Supported)
BIOS AMI UEFI BIOS
System Windows 10 x64, Linux
I/O Interface
Serial Port 6*RS232(Up to 18*RS232 with SV-M5-CU)
USB 2*USB 3.0, 8*USB 2.0(Up to 18*USB 2.0 with SV-M5-CU)
Ethernet 2*Realtek® PCI-E LAN for 1000Mbps
Audio Realtek® ALC662 5.1 channel HDA Codec, supports MIC/Line-outPorts
PS/2 1*PS/2 (Keyboard Supported)
Parallel Port 1* LPT
GPIO 8 programmable GPIO
Feature Interface Null
Display
Display Interface

1*VGA:max resolution up to 1920*1200

1*HDMI:max resolution up to 4096*2160
Multiple Display Dual
Mechanical & Environment   
Dimension Mini-ITX, 170*170mm
Power Input ATX PSU
Temperature Operation: 0℃~60℃, Storage: -25℃~75℃
Relative Humidity Operation: 10%~90%, Storage: 5%~95%, non-condensing
嵌入式主板

嵌入式主板

嵌入式主板
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