君正集成电路 T10嵌入式主板介绍

嵌入式主板

君正集成电路

• 专业级成像ISP和H.264编码(960P) • 高性能处理器支持智能分析(>1G CPU,128Bits SIMD引擎) • 业内最低功耗(典型功耗390mW 含DDRII)

芯片框图

  芯片规格

CPU	XBurst single core, up to 1GHz. MXU2.0 IVS Engine, innovative 128 bit SIMD extension instruction 32KB L1 I-cache and 32KB L1 D-cache. 128KB L2 unified cache.  Hardware floating point unit.
Encoder engine	H.264 baseline, main profile MJPEG/JPEG Baseline
Encode Performance	Max resolution 1280x960 Up to H.264 960P@40fps encode H.264 multiple streams --720P@30fps+VGA@30fps+JPEG@15fps --960P@30fps+VGA@30fps+JPEG@15fps ABR/VBR/CBR/CQP 8 ROIs 5-layer OSD with hardware
ISP	AE, AWB, AF Lens shading correction Advanced spatial noise reduction Motion-adaptive temporal noise reduction (3D de-noise) Multi-exposure HDR image fusion (WDR) Space-variant HDR processing Host tuning tools
Memory	Embedded DDRII@400Mhz Maximum capacity of 512Mbit
Computer Vision	Motion Detection/Perimeter Protection Face Detection Human Detection People Counting License Plate Recognition
CMOS Sensor	Maximum 12 bit HSYNC/VSYNC (DVP) I2C sensor control, Flash and DC control Programmable sensor clock output Up to 100M pixels/s input
Audio	Embedded audio CODEC. AAC, G726, G711, PCM encoding Echo cancellation
On-chip Peripherals	POR, RTC, WDT 2 channel ADC UART x 2, I2C x 2, SPI x 2, GPIO x 12 SDIO x 2, support SDHC PWM x 4 USB OTG RMII EMAC, support PHY clock output.
Security	AES/DES/3DES by Hardware Global unique Chip ID 32Byte customer OTP
Physical Feature	Less than 400mW power consumption including DDRII TFBGA181 ROHS, ball pitch of 0.65mm,body size of 10mmx10mm
OS	Linux-3.10.