飞凌嵌入式FETMX8MM-C核心板介绍

CPU：NXP i.MX8M Mini

架构：四核Cortex-A53+M4

主频：1.8GHz

内存：2GB DDR4

ROM：8GB eMMC 

系统：Linux4.14.78+QT5.10.1、Android9.0

 

FETMX8MM-C核心板

FETMX8MM-C 核心板基于NXP 公司的i.MX8M Mini 四核64位处理器设计，主频最高1.8GHz，ARM Cortex-A53架构；2GB DDR4 RAM，支持一个通用型Cortex®-M4 400 MHz内核处理器。可提供多种音频接口，包括I2S、AC97、TDM、PDM和SPDIF。提供多种外设接口，如MIPI-CSI、MIPI-DSI、USB、PCIe、UART、eCSPI、IIC和千兆以太网。

目标应用：

·IP摄像头视频监控                       ·双向视频会议

·可视门铃                                    ·图像分析

·音频处理                                    ·音频广播系统

 

 

 

 

 

▊规格参数

CPU

• Cortex A53 Core：

  • 4x Cortex-A53 processors

• • Target frequency of 1.8GHz

• • Support of 64-bit Armv8-A architecture

• • Floating Point Unit (FPU) with support of the   VFPv4-D16 architecture

• • 32 KB L1 Instruction Cache

• • 32 KB L1 Data Cache

• • 512 KB unified L2 cache

• Cortex M4 Core：

  • 1x Cortex-M4 processor

• •  frequency of 400MHz

• • 256 KB tightly coupled memory (TCM，128 KB TCMU, 128 KB TCML)

RAM

• • 2GB

• • DDR4 

ROM

• • 8GB

• • eMMC Flash

Multimedia Interface

• LCDIF Display Controller:

• • Support up to 2 layers of overlay

• • Support up to 1080p60 display through MIPI DSI

• MIPI Interface:

• • 4-lane MIPI CSI interface,operating up to a maximum bit rate of 1.5 Gbps.

• • 4-lane MIPI DSI interface,operating up to a maximum bit rate of 1.5 Gbps.

• Audio:

• • SPDIF input and output, including a new Raw Capture input mode

• • Five synchronous audio interface (SAI) modules supporting I2S,AC97, TDM,codec/DSP,and DSD interfaces, including one SAI with 8 Tx and 8 Rx lanes, one SAI with 4 Tx and 4 Rx lanes,two SAI with 2 Tx and 2 Rx lanes,and one SAI with 1 Tx and 1Rx lane. Support over 20 channels of audio subject to I/O limitations.

• • 8-Channel Pulse Density Modulation (PDM) input

GPU

• 3D GPU Core:

• • GCNanoUltra

• • Support OpenGL ES 1.1, 2.0

• • Support OpenVG 1.1

• • TrustZone support using a local MMU to manage secure regions

• 2D GPU Core:

• • GC320

• • Support multi-source composition

• • Support one-pass filter

VPU

• Decoder：

• • 1080p60 VP9 Profile 0, 2 (10-bit)

• • 1080p60 HEVC/H.265 Decoder

• • 1080p60 AVC/H.264 Baseline, Main, High decoder

• • 1080p60 VP8

• Encoder：

• • 1080p60 AVC/H.264 Encoder

• • 1080p60 VP8

PCle

• One PCI Express (PCIe)

• • Single lane supporting PCIe Gen2

• • Dual mode operation to function as root complex or   endpoint

• • Integrated PHY interface

• • Support L1 low power sub-state

USB

• Two USB 2.0 OTG controllers with integrated PHY interfaces

SD/SDIO

• Two Ultra Secure Digital Host Controller (uSDHC) interfaces:

• • SD/SDIO 3.0 compliance with 200 MHz SDR signaling to support up to 100MB/sec

• • Support for SDXC (extended capacity)

• • 1.8 V and 3.3 V operation, but do not support 1.2V operation.

Ethernet

• One Gigabit Ethernet controller：

• • support for Energy Efficient Ethernet (EEE)

• • Ethernet AVB,

• • IEEE 1588

UART

• Four Universal Asynchronous Receiver/Transmitter (UART) modules：

• • 7- or 8-bit data words, 1 or 2 stop bits,   programmable parity (even,odd, or none)

• • Programmable baud rates up to 4 Mbps.

• • 32-byte FIFO on Tx and 32 half-word   FIFO on Rx supporting auto-baud

I2C

• Four I2C modules：

• I2C provides serial interface for external devices. Data rates of   up to 320 kbps are supported.

eCSPI

• Three eCSPI modules：

• Full-duplex enhanced Synchronous Serial Interface, with data rate up   to 52 Mbit/s. Configurable to support Master/Slave modes, four chip selects   to support multiple peripherals.

FlexSPI

• The FlexSPI module acts s an interface to external serial flash devices.   This module contains the following features:

• • Flexible sequence engine to support various flash   vendor devices

• • Single pad/Dual pad/Quad pad mode of operation

• • Single Data Rate/Double Data Rate mode of operation

• • Parallel Flash mode

• • DMA support

• • Memory mapped read access to connected flash devices

• • Multi master access with priority and flexible and   configurable buffer for each master