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随着信息通信技术的发展,自旋轨道矩器件因低功耗、亚纳秒速度的自旋操控成为研究热点。其中,强自旋轨道耦合作用引起的自旋霍尔效应是产生自旋轨道矩翻转的重要物理效应之一。它指的是当外加纵向电场时会诱导产生一个横向的纯自旋流。一般来说,自旋霍尔效应是通过自旋霍尔电导率(SHC)进行表征和测量。
通常来说,自旋霍尔效应的本征机制与拓扑非平庸能带密切相关,这可通过第一性原理计算和Kubo公式进行研究。拓扑绝缘体一直被看作是产生纯自旋流的理想材料。但实验显示,表面态和体态杂化导致的体态载流子问题限制了拓扑绝缘体在自旋电子器件中的广泛应用。最近,人们认识到含重金属元素的化合物可能存在很大的自旋霍尔效应。尤其是具有自旋动量锁定特性的拓扑半金属引起了人们极大的研究兴趣。而目前为止,具有高SHC的拓扑半金属仍较缺乏。
来自北京航空航天大学集成电路科学与工程学院的IEEE Fellow赵巍胜教授与中国科学院大学朱振刚教授、兰州大学罗洪刚教授组成联合团队,基于第一性原理计算以及团队成员自行开发的高效Wannier-interpolation方法探索到狄拉克半金属砷化钽(Ta3As)家族费米面处具有很高的SHC,其值高达1500 ~ 1700。
通过对拓扑表面态与自旋输运特性分析,发现Ta3As家族材料呈现出复杂的狄拉克拓扑节线半金属特性:(a)当考虑自旋轨道耦合时,费米面附近具有鼓膜状拓扑表面态。(b)在不考虑自旋轨道耦合时,费米面附近的狄拉克点构成了复杂的交叉节线,即三条节线在顶点处相交于一点,然而在中心处两条节线相交形成一个网格。该研究为在具有复杂物理效应的拓扑交叉节线半金属中探索高SHC以及构建新一代自旋轨道矩的自旋电子器件提供了新的发展方向。
该文近期发表于npj Computational Materials 7: 37 (2021)。
Prediction of crossing-nodal-lines and large intrinsic spin Hall conductivity in topological Dirac semimetal Ta3As family
Wenjie Hou, Jian Liu, Xi Zuo, Jian Xu, Xueying Zhang, Desheng Liu, Mingwen Zhao, Zhen-Gang Zhu, Hong-Gang Luo & Weisheng Zhao
Topological insulators (TIs) are considered as ideal platforms for generating large spin Hall conductivity (SHC), however, the bulk carrier problem, which is unavoidable in TIs, hinders their practical applications. Recently, topological semimetals (TSMs) have been proposed to achieve large SHC to replace TIs. However, the ideal TSM candidates with large SHC are still lacking. In terms of first-principles calculations, we predict that Ta3As family compounds exhibit complex crossing-nodal-lines (CNL) properties in absence of the spin-orbit coupling (SOC)。 However, they transfer to Dirac TSMs under the influence of strong SOC, and present large SHC around Fermi level in particular. Remarkably, the SHC value of Ta3Y (Y=As, Sb, Bi) is around 1500 ~ 1700 , which is comparable to noble metal Pt and much larger than TIs, Weyl TSMs, and 4d/5d transition metals. Our work not only suggests a kind of TSM family with interesting Dirac CNL around Fermi level, but also paves the way for searching large intrinsic SHC materials in complex CNL TSM systems.
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