常用集成电路的封装形式

常用集成电路的封装形式

常用集成电路的封装形式
	CLCC
	DIP Dual Inline Package
	DIP-tab Dual Inline Package with Metal Heatsink
	FBGA
	FDIP
	FTO220
	Flat Pack
	HSOP28
	ITO220
	ITO3p
	JLCC
	LCC
	LDCC
	LGA
	LQFP
	PCDIP
	PLCC
	PQFP
	PSDIP
	LQFP 100L
	METAL QUAD 100L
	PQFP 100L
	QFP Quad Flat Package
	SOT143
	SOT220
	SOT223
	SOT223
	SOT23
	SOT23/SOT323
	SOT25/SOT353
	SOT26/SOT363
	SOT343
	SOT523
	SOT89
	SOT89
	LAMINATE TCSP 20L Chip Scale Package
	TO252
	TO263/TO268
	SO DIMM Small Outline Dual In-line Memory Module
		QFP Quad Flat Package
		TQFP 100L
		SBGA
		SC-70 5L
		SDIP
		SIP Single Inline Package
		SO Small Outline Package
		SOJ 32L
		SOJ
		SOP EIAJ TYPE II 14L
		SOT220
		SSOP 16L
		SSOP
		TO18
		TO220
		TO247
		TO264
		TO3
		TO5
		TO52
		TO71
		TO72
		TO78
		TO8
		TO92
		TO93
		TO99
		TSOP Thin Small Outline Package
		TSSOP or TSOP II Thin Shrink Outline Package
		uBGA Micro Ball Grid Array
		ZIP Zig-Zag Inline Package
		BQFP132
TEPBGA 288L		TEPBGA 288L
		C-Bend Lead
		CERQUAD Ceramic Quad Flat Pack
		Ceramic Case
		Gull Wing Leads
J-STD		J-STD Joint IPC / JEDEC Standards
JEP		JEP JEDEC Publications
JESD		JESD JEDEC Standards
		LLP 8La
		PCMCIA
		PDIP
		PLCC
PS/2		PS/2 mouse port pinout
SIMM30		SIMM30 Pinout
SIMM72		SIMM72 Pinout
		SNAPTK
		SNAPTK
		SNAPZP
		SOH