台庆 | 科车用等级高耐流低直流阻抗芯片磁珠

HFZ-SERIES

芯片磁珠在EMI应用市场上一直扮演的重要角色，不论任何的电子产品，总是需要芯片磁珠的挹注，方能做到完善的电磁兼容，在避免讯号失真的同时，更减少影响到生活周边的各项电子设施。

Chip beads have always played an important role in the EMI suppression application. Regardless of any electronic products, the use of chip beads are always required to achieve perfect electromagnetic compatibility. While avoiding signal distortion, it also reduces the EMI noise that may impact on surrounding electronic products.

芯片磁珠主要材料组成包含了铁氧体、银、镍、锡等，而磁珠生产透过使用不同的铁氧体材料使得在不同的频率应用下，有效解决EMI各项问题。

The main material composition of ferrite chip beads includes ferrite, silver, nickel, tin, etc., and the production of chip beads use different ferrite materials to effectively solve various EMI problems under different frequency applications.

随着科技的日新月异，电子市场上充斥各类不同型态的产品，各个生产厂商无所不用其极的希望自家产品都能够做到产品的独创性、与他人的差异性、当然更重要的还是需要做到产品的微型化。

With the rapid development of technology, the electronic market is flooded with various types of products. Each manufacturer hopes that their products can achieve uniqueness and differentiation from others, and of course, the miniaturization of the products is also important.

台庆科所推出的新型芯片磁珠产品HFZ-SERIES，透过台庆科自行设计的自动化生产机具，加上特制铁氧体及其他材料搭配，找正品元器件，上唯样商城，成功优化产品性能，并且产品经过车用等级AEC-Q200的严格检测要求，更是有效利用于汽车电子市场。

TAI-TECH’s Technology has introduced a new type of chip bead product, the HFZ-SERIES, which optimizes product performance through its self-designed automated production equipment, special ferrite and other materials. The product has also passed strict reliability testing requirements, such as the automotive-grade AEC-Q200 standard, making it effective to apply in the automotive electronics application.

HFZ具备着低直流阻抗的产品特性，使得产品应用温度更加具有弹性，小型化大电流的产品设计也为工程师LAYOUT设计增加更多利用率，也减少材料成本。

HFZ Series features low DCR, and it effectively performs compact size and high current performance with wide operating temperature range, which is flexible and high utilization for engineer’s PCB layout design, and cost saving.

The use of HFZ-series can reduce both the size and the cost, which avoid the impact of material price fluctuations.

HFZ is smaller in size, and also provides a better temperature rise performance.

产品特点

1、适用于 -55°C ~ 125°C度操作温度范围

Operating temperature -55°C ~ 125°C

2、符合 RoHS、 REACH 、Lead Free等环境要求

100% Lead (Pb) & Halogen-Free and REACH & RoHS compliant.

3、产品低直流阻抗、低损耗

Low DCR & Low loss

4、适用于波锋焊制程应用

Suitable for wave soldering process applications

5、符合车用等级 AEC-Q200测试要求

Reliability test complied with AEC-Q200.

主要产品规格特性

审核编辑 黄宇