关于锂电池管理系统的硬件电路方案

本文介绍一套关于锂电池管理系统的硬件电路方案。其本身是一套已经实际应用的成熟的方案，功能包括单电池放电模组，电池组放电模组。硬件电路方案包含完整的原理图和PCB文件。整套方案包含3块板子，其功能框图如上图所示，包括电池串管理单元，CAN，RS485，电池检测单元，风扇电路，温度采集。

硬件方案--电池CPU主板

Comment	Designator	Footprint
33pF	C1_A, C9_A	0805
0.1uF	C1_B, C1_E, C2_E, C4_E, C5_E	0805
103	C1_D	0805
100uF/250V	C1_G	100UF/250V
22uF/25V	C2_A, C2_D, C3_A, C4_A, C6_G, C7_G, C10_A, C10_G, C11_G	7227A
CD2	C2_G	CD2
104	C3_D, C3_E, C5_A, C5_G, C6_A, C7_A, C8_A, C8_G, C9_G, C11_A, C12_A, C12_G, C14_A, C15_A, C16_A, C17_A, C18_A, C19_A, C20_A, C21_A, C22_A, C23_A, C24_A	0805
0.1uF	C3_G, C4_G	CT2
LPC2294	D1_A	LQFP144-1
SHT11	D1_B	LCC-8
SP3220E	D1_E	SSOP16
PC817	D1_F, D2_F, D3_A, D4_A	SSOP4
SP706SEN	D2_A	SO-8
INDUCTOR	L1_A, L3_G, L4_G, L5_G	0805
220uH	L1_G, L2_G	220UH
CTM8251T	N1_D	CTM8251
WRB1205ZP-3W	N1_G	WRB1205DIP
SPX1117M3-3.3	N2_G	SOT-223
SPX1117M3-1.8	N3_G	SOT-223
IR3205	Q1_F, Q2_F	TO-220C
100K	R1_A, R1_F, R3_F, R5_F, R6_A	0805
10K	R1_B, R1_C, R1_E, R1_G, R2_B, R2_C, R3_A, R5_A, R6_F, R7_A, R8_A, R9_A, R10_A, R11_A, R12_A, R13_A, R20_A, R23_A, R25_A, R26_A, R29_A	0805
120	R1_D	0805
1M	R2_D	0805
1K	R2_F, R4_F	0805
R4	R3_C, R4_C	0805
100	R22_A	0805
0	R24_A	0805
4.7K	R30_A	0805
	S1_D	SHORTER
SW_4BIT	SW1	SO-8
Red	V1_A, V4_G	LED2
BYV26C	V1_F, V3_F	DO-214AC
1N5819	V1_G, V2_G	DO-214AC
Green	V2_A	LED2
DW3	V2_F, V4_F	1N4148
SMBJ18A	V3_G	DO-214AA
CON2	X1_A, X1_F, X3_F	Z2-4.0
CON6	X1_C	Z6-4.0
CAN	X1_D	Z3-4.0
CON3	X1_E, X1_G, X2_A, X2_F, X5_A	Z3-4.0

电池CPU主板是系统核心控制模块，主控采用的是LQFP144封装的恩智浦（NXP）的LPC2294，串口232芯片采用的是SP3220E，CAN接口采用的是隔离收发模块CTM8251T。电源是12V-5V-3.3V-1.8V，采用的是隔离电源模块WRB1205ZP-3W。LDO是SPX1117M3-3.3，SPX1117M3-1.8。通过光耦PC817 MOS管IR3205来驱动风扇。温湿度传感器SHT11，不过貌似已经停产了。PCB是2层板，覆铜版本，layout及丝印都很工整。

硬件方案--BMS板

Comment	Designator	Footprint
104/100V	C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13	1206
104	C14, C15, C16, C17, C21, C22	0805
105	C18, C19	0805
22uF/25V	C20, C23	7227A
2.2uF/16V	C24	0805
220nF/50V	C25	0805
1uF/100V	C26, C27	1206
LTC6803-2	D1	SSOP44
SMBJ54A	D2	DO-214AC
BAT46W	D3, D4, D8	SOD-123
MBR0540	D5	SOD-123
BAT54S	D6	SOT_23A
BLM31PG330SH1B	L1	1206
ISC1210ER470	L2	L1210
LT6004	N1	MSOP-8
ADUM1401	N2	SO-16W
1B0505	N3	1B0505-2
LT3495	N4	DFN103X2
100	R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12, R13, R34, R35, R36, R37, R39, R40, R41, R42, R43, R44	0805
100K	R14, R15	0805
10K	R16, R17	0805
1M	R18, R19, R20, R21, R22, R23, R25, R27	0805
2M	R24, R26, R28, R30	0805
4.7M	R29	0805
0	R31, R38	0805
10M	R32	0805
100KNTC	RT1, RT2	SIP2
SW-4BIT	SW1	SO-8
CON13	X1	W13-4.0
CON6	X2	W6-4.0
PDZ7.5B	ZD1, ZD2, ZD3, ZD4, ZD5, ZD6, ZD7, ZD8, ZD9, ZD10, ZD11, ZD12	SOD-323

BMS板采用的是ADI的LTC6803电池管理芯片12串电池，温度信号放大采用的是ADI的轨对轨运算放大器LT6004。其他的芯片包括数字隔离芯片ADUM1401，DCDC芯片LT3495等。PCB是双层板，覆铜，layout及丝印都很工整。

硬件方案--主控板

Comment	Designator	Footprint
CR1220	B1_I	CR1220
33pF	C1_A, C9_A	0805
103	C1_B, C4_B	0805
0.1uF	C1_E, C2_E, C3_E, C4_E, C4_G	0805
104	C1_F, C1_H, C1_I, C3_B, C5_A, C5_E, C5_G, C6_A, C6_B, C7_A, C8_A, C8_G, C9_G, C11_A, C12_A, C12_G, C14_A, C15_A, C15_E, C16_A, C17_A, C18_A, C19_A, C20_A, C20_E, C21_A, C22_A, C22_E, C23_A, C24_A, C24_E	0805
470uF/50V	C1_G, C2_G	470uF/50V
22uF/25V	C2_A, C2_B, C4_A, C5_B, C7_G, C10_A, C10_G, C11_G, C21_E, C23_E, C25_E	7227A
0.1uF	C3_G	CT2
CT2	C6_E, C8_E, C9_E, C12_E, C13_E, C17_E, C18_E	0805
22uF/50V	C6_G	7227A
0.01uF	C7_E, C11_E, C16_E	0805
0.47uF	C10_E, C14_E, C19_E	0805
LPC2294	D1_A	LQFP144-1
SP3220E	D1_E	SSOP16
FM24CL04	D1_F	SO-8
SST25V016B	D1_H	SO-8
RX-8025SA	D1_I	SOP-14
SP706SEN	D2_A	SO-8
INDUCTOR	L1_A, L3_G, L4_G, L5_G, L6_G	0805
220uH	L1_G, L2_G	220UH
CTM8251T	N1_B, N2_B	CTM8251
LT6004H	N1_E, N2_E	MSOP-8
WRB1205ZP-3W	N1_G	WRB1205DIP
SPX1117M3-3.3	N2_G	SOT-223
WRA1215CKS-1W	N3_E	WRA1215
SPX1117M3-1.8	N3_G	SOT-223
IR3205	Q1D, Q2D, Q3D, Q4D	TO-220C
120	R1_B, R3_B	0805
10k	R1_E, R1_F, R1_G, R1_H, R1_I, R2_F, R2_I, R3_H, R3D, R4_H, R5_H, R6_H, R6D, R7_A, R8_A, R9_A, R9D, R10_A, R11_A, R12_A, R12D, R13_A, R20_A, R23_A, R25_A, R26_A, R29_A	0805
100K	R1D, R4D, R7D, R10D	0805
1M	R2_B, R4_B	0805
20K	R2_E, R8_E, R14_E	0805
1K	R2_H, R2D, R5D, R8D, R11D	0805
47K	R3_E, R4_E, R9_E, R10_E, R15_E, R16_E	0805
100	R5_E, R11_E, R17_E, R22_A	0805
100K/1%	R6_E, R7_E, R12_E, R13_E, R18_E, R19_E	0805
0	R24_A	0805
4.7K	R30_A	0805
	S1_B, S2_B	SHORTER
SW_4BIT	SW1	SO-8
PC817	U1D, U2D, U3D, U4D	SSOP4
Red	V1_A, V4_G	LED2
DW3	V1_E, V2_E, V2D, V3_E, V4D, V6D, V8D	1N4148
1N5819	V1_G, V2_G	DO-214AC
1N4148	V1_I, V2_I	1N4148
IN5819	V1D, V3D, V5D, V7D	DO-214AC
Green	V2_A	LED2
SMBJ18A	V3_G	DO-214AA
CON3	X1_A, X1_E, X1_G, X5D	Z3-4.0

主控板是系统核心控制模块，主控采用的是LQFP144封装的恩智浦（NXP）的LPC2294，串口232芯片采用的是SP3220E，2路CAN接口采用的是隔离收发模块CTM8251T。电源是12V-5V-3.3V-1.8V，采用的是隔离电源模块WRB1205ZP-3W。LDO是SPX1117M3-3.3，SPX1117M3-1.8。通过光耦PC817 MOS管IR3205控制外部继电器模块。电源方案采用和电池CPU电路板一样的电路。增加了FRAM模块采用FM24CL04，还有一片FLASH芯片，RTC模块以及纽扣电池座CR1220，RTC芯片采用的是RX-8025SA。

审核编辑：汤梓红