资料下载
×
Evaluating the Integrity of LG
消耗积分:2 |
格式:rar |
大小:322 |
2009-09-23
分享资料个
Evaluating the Integrity of LGA Package, 2nd Level Interconnect for μModule Family of Products:A good interconnect solution provides performance and
cost benefi ts, ease of manufacturing, and meets or exceeds
industry reliability requirements for any application. When
the LGA component interconnect was introduced, board
level manufacturers were given the task of incorporating
the new component interconnect with their existing process.
New interconnects often improve processing, but
the acceptance for new interconnects can cause confl icts
between the design engineers who need the new capability
and manufacturing engineers who must accommodate
the new package interconnect with their existing process
and equipment. The LGA interconnect offers the designers
better thermal and electrical performance and the
manufacturing engineers the advantage of using existing
equipment and processes, thus reducing both design and
manufacturing development cycle times.
cost benefi ts, ease of manufacturing, and meets or exceeds
industry reliability requirements for any application. When
the LGA component interconnect was introduced, board
level manufacturers were given the task of incorporating
the new component interconnect with their existing process.
New interconnects often improve processing, but
the acceptance for new interconnects can cause confl icts
between the design engineers who need the new capability
and manufacturing engineers who must accommodate
the new package interconnect with their existing process
and equipment. The LGA interconnect offers the designers
better thermal and electrical performance and the
manufacturing engineers the advantage of using existing
equipment and processes, thus reducing both design and
manufacturing development cycle times.
声明：本文内容及配图由入驻作者撰写或者入驻合作网站授权转载。文章观点仅代表作者本人，不代表电子发烧友网立场。文章及其配图仅供工程师学习之用，如有内容侵权或者其他违规问题，请联系本站处理。 举报投诉
评论(0)
发评论
- 相关下载
- 相关文章
