FEATURES Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V - Backward compatible to 1.5V High speed data transfer rates with system frequency up to 933 MHz 8 internal banks for concurrent operation 8n-bit pre-fetch architecture Programmable CAS Latency Programmable Additive Latency: 0, CL-1,CL-2 Programmable CAS WRITE latency (CWL) based on tCK Programmable Burst Length: 4 and 8 Programmable Burst Sequence: Sequential or Interleave BL switch on the fly Auto Self Refresh(ASR) Self Refresh Temperature(SRT) Refresh Interval: 7.8 us (8192 cycles/64 ms) Tc= -40°C to 85°C 3.9 us (8192 cycles/32 ms) Tc= 85°C to 105°C Partial Array Self Refresh Asynchronous RESET pin TDQS (Termination Data Strobe) supported (x8 only) OCD (Off-Chip Driver Impedance Adjustment) Dynamic ODT (On-Die Termination) Driver strength : RZQ/7, RZQ/6 (RZQ = 240 ) Write Leveling Up to 200 MHz on DLL off mode Operating temperature: Commercial (TC = 0°C to +95°C) Industrial (TC = -40°C to +95°C) Automotive, A1 (TC = -40°C to +95°C) Automotive, A2 (TC = -40°C to +105°C)

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