中国半导体技术大会CSTIC2018中国国际半导体技术大会(CSTIC),SEMI、IMEC、IEEE和中国高科技专家组联合举办的亚洲最大的世界级半导体技术研讨会。自2000年举行以来,至今已经成功举办了17届,会议主要涉及manufacturing processes, devices design, integration, materials, equipment等内容,也包括半导体行业中热门话题,如memory technology, 3D integration, MEMS等。CSTIC 2018,将于2018年3月11-12号,在上海国际会议中心举行,与SEMICON CHINA 2018展会同期举办。
Distinguished Conference Keynote Speakers:
部分特邀演讲嘉宾:
Conference Programs:
Symposium I: |
Device Engineering and Memory Technology |
Symposium II: |
Lithography and Patterning |
Symposium III: |
Dry & Wet Etch and Cleaning |
Symposium IV: |
Thin Film, Plating and Process Integration |
Symposium V: |
CMP and Post-Polish Cleaning |
Symposium VI: |
Metrology, Reliability and Testing |
Symposium VII: |
Packaging and Assembly |
Symposium VIII: |
MEMS, Sensors and Emerging Semiconductor Technologies |
Symposium IX: |
Design and Automation of Circuits and Systems |
主办:
合办:
出版机构:
大会时间及地点:
March 11-12, 2018Shanghai International Convention Center上海国际会议中心 中国上海浦东滨江大道2727号No.2727 Riverside Avenue Pudong, Shanghai 200120, China
参会注册及联系方式:
Kelly Zhang, SEMI China
Tel: 86.21.6027.8556Fax: 86.21.6027.8511Email: kzhang@semi.org
参会费用:2500元人民币/人
全部0条评论
快来发表一下你的评论吧 !