×

Scratch Testing of Low-k Diele

消耗积分:3 | 格式:rar | 大小:467 | 2010-08-17

分享资料个

Introduction
The processing that is required to lower
the dielectric constant in a low-k fi lm
has the adverse effect of degrading the
mechanical properties of the fi lm. Low-k
fi lms are subjected to many processes
that test the strength of these fi lms and
their adhesion to the substrate such
as chemical and mechanical polishing
(CMP) and wire bonding. It is important
for these materials to resist plastic
deformation during these processes
and remain intact without blistering up
from the substrate. Ideally, a dielectric
material will have a high hardness and
elastic modulus because, traditionally,
these two parameters help to defi ne
how the material will react when
subjected to manufacturing processes.
In this application note, scratch
tests are preformed on several low-k
samples using a ramp-load scratch
test. The results from scratch testing
and nanoindentation are examined
through correlation analysis to better
understand the interconnectedness
of scratch results.

声明:本文内容及配图由入驻作者撰写或者入驻合作网站授权转载。文章观点仅代表作者本人,不代表电子发烧友网立场。文章及其配图仅供工程师学习之用,如有内容侵权或者其他违规问题,请联系本站处理。 举报投诉

评论(0)
发评论

下载排行榜

全部0条评论

快来发表一下你的评论吧 !