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深圳市国宇航芯科技有限公司

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XCZU21DR-2FFVD1156E  供应商XCZU21DR-2FFVD1156E  怎么订货XCZU21DR-2FFVD1156E  价格  
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XCZU21DR-2FFVD1156E芯片详细信息

  • Manufacturer Part Number:

XCZU21DR-2FFVD1156E

  • Rohs Code:

Yes

  • Part Life Cycle Code:

Active

  • Package Description:

FCBGA-1156

  • Reach Compliance Code:

compliant

  • ECCN Code:

5A002.A.4

  • HTS Code:

8542.39.00.01

  • Date Of Intro:

2017-12-19

  • Manufacturer:

Xilinx

  • Risk Rank:

5.81

  • JESD-30 Code:

R-PBGA-B1156

  • JESD-609 Code:

e1

  • Moisture Sensitivity Level:

4

  • Number of Terminals:

1156

  • Operating Temperature-Max:

100 °C

  • Package Body Material:

PLASTIC/EPOXY

  • Package Code:

BGA

  • Package Shape:

RECTANGULAR

  • Package Style:

GRID ARRAY

  • Peak Reflow Temperature (Cel):

NOT SPECIFIED

  • Supply Voltage-Max:

0.876 V

  • Supply Voltage-Min:

0.825 V

  • Supply Voltage-Nom:

0.85 V

  • Surface Mount:

YES