公司logo

华秋商城

1.8w內容 |  99w+浏览量  |  5k粉丝

+关注

--- 产品详情 ---

具有负电压轨处理功能和 1.8V 输入逻辑的 0.7Ω、5V、2:1 (SPDT) 2 通道模拟开关
Protocols Analog Audio
Configuration 2:1 SPDT
Number of channels (#) 2
Bandwidth (MHz) 32
Supply voltage (Max) (V) 5.5
Supply voltage (Min) (V) 2.75
Ron (Typ) (Ohms) 0.7
Input/ouput voltage (Min) (V) -3.25
Input/ouput voltage (Max) (V) 5.5
Supply current (Typ) (uA) 1
ESD HBM (Typ) (kV) 2.5
Operating temperature range (C) -40 to 85
Crosstalk (dB) -70
ESD CDM (kV) 1
ICC (Typ) (uA) 6
Input/output continuous current (Max) (mA) 150
COFF (Typ) (pF) 48
CON (Typ) (pF) 176
Off isolation (Typ) (dB) -70
OFF-state leakage current (Max) (μA) 0.375
Ron (Max) (Ohms) 2
Ron channel match (Max) (Ohms) 1
RON flatness (Typ) (Ohms) 0.0135
Turn off time (disable) (Max) (ns) 206
Turn on time (enable) (Max) (ns) 470
VIH (Min) (V) 1.05
VIL (Max) (V) 0.65
  • Negative Signaling Capability: Maximum Swing From –2.75 V to 2.75 V (V+ = 2.75 V)
  • Low ON-State Resistance (0.7 Ω Typ)
  • Excellent ON-State Resistance Matching
  • 1.8-V Compatible Control Input Threshold Independent of V+
  • Control Inputs Are 5.5-V Tolerant
  • 2.25-V to 5.5-V Power Supply (V+)
  • Low Charge Injection
  • Specified Break-Before-Make Switching
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2500-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
    • 200-V Machine Model (A115-A)

The TS5A22366 is a dual single-pole double-throw (SPDT) analog switch that is designed to operate from 2.25 V to 5.5 V. The device features negative signal capability that allows signals below ground to pass through the switch without distortion.

The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications.

The TS5A22366 is available is a ultra small 1.6 mm × 1.2 mm wafer-chip-scale package (WCSP) (0.4 mm pitch).