| Function | Serializer |
| Color depth (bpp) | 24 |
| Input compatibility | LVDS |
| Pixel clock frequency (Max) (MHz) | 68 |
| Output compatibility | FPD-Link LVDS |
| Features | Low-EMI Point-to-Point Communication |
| Operating temperature range (C) | -10 to 70 |
- No Special Start-up Sequence Required Between Clock/Data and /PD Pins. Input Signal (Clock and Data) Can be Applied Either Before or After the Device is Powered.
- Support Spread Spectrum Clocking Up to 100KHz Frequency Modulation & Deviations of ±2.5% Center Spread or ?5% Down Spread.
- "Input Clock Detection" Feature Will Pull All LVDS Pairs to Logic Low when Input Clock is Missing and When /PD Pin is Logic High.
- 18 to 68 MHz Shift Clock Support
- Best–in–Class Set & Hold Times on TxINPUTs
- Tx Power Consumption < 130 mW (typ) @65MHz Grayscale
- 40% Less Power Dissipation Than BiCMOS Alternatives
- Tx Power-down Mode < 60μW (typ)
- Supports VGA, SVGA, XGA and Dual Pixel SXGA.
- Narrow Cus Reduces Cable Size and Cost
- Up to 1.8 Gbps Throughput
- Up to 227 Megabytes/sec Bandwidth
- 345 mV (typ) Swing LVDS Devices for Low EMI
- PLL Requires No External Components
- Compatible with TIA/EIA-644 LVDS Standard
- Low Profile 56-Lead TSSOP Package
- Improved Replacement for:
- SN75LVDS83, DS90CF383A
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The DS90CF383B transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughput is 227 Mbytes/sec. The DS90CF383B is fixed as a Falling edge strobe transmitter and will interoperate with a Falling edge strobe Receiver (DS90CF386) without any translation logic.
This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.