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具有自动方向感应和 +/-15kV ESD 保护的 2 位双向电压电平转换器
Technology Family TXB
Applications MDIO
Bits (#) 2
High input voltage (Min) (Vih) 0.78
High input voltage (Max) (Vih) 5.5
Vout (Min) (V) 1.2
Vout (Max) (V) 5.5
IOH (Max) (mA) -0.02
IOL (Max) (mA) 0.02
Rating Catalog
  • Available in the Texas Instruments NanoFree? Packages
  • 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V On
    B Port (VCCA≤ VCCB)
  • VCC Isolation Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State
  • OE Input Circuit Referenced to VCCA
  • Low Power Consumption, 4-μA Max ICC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • A Port
      • 2500-V Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)
    • B Port
      • 15-kV Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1500-V Charged-Device Model (C101)

The TXB0102 device is a 2-bit noninverting translator that uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA must not exceed VCCB.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

OE must be tied to GND through a pulldown resistor to assure the high-impedance state during power up or power down; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoFree? technology is a major breakthrough in IC packaging concepts, using the die as the package.