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具有集成电流检测和反馈功能的汽车类 40V、21A H 桥驱动器
Number of full bridges 1
Vs (Min) (V) 4.5
Vs ABS (Max) (V) 40
Peak output current (A) 21
RDS(ON) (HS + LS) (mOhms) 45
Sleep current (uA) 5
Control mode Independent 1/2-Bridge, PH/EN, PWM
Control interface Hardware (GPIO), Serial
Features Current Regulation, Current Sense Amplifier, Integrated Current Sensing, Open-Load Detection
Rating Automotive
Operating temperature range (C) -40 to 125
  • AEC-Q100 qualified for automotive applications:
    • Temperature grade 1: –40°C to +125°C, TA
    • Documentation available to aid functional safety system design
  • 4.5-V to 35-V (40-V abs. max) operating range
  • VQFN-HR package: RON_LS + RON_HS: 47 mΩ
  • HVSSOP package: RON_LS + RON_HS: 60 mΩ
  • IOUT Max = 21 A
  • PWM frequency operation up to 25 KHz with automatic dead time assertion
  • Configurable slew rate and spread spectrum clocking for low electromagnetic interference (EMI)
  • Integrated current sense (eliminates shunt resistor)
  • Proportional load current output on IPROPI pin
  • Configurable current regulation
  • Protection and diagnostic features with configurable fault reaction (latched or retry)
    • Load diagnostics in both the off-state and on-state to detect open load and short circuit
    • Voltage monitoring on supply (VM)
    • Over current protection
    • Over temperature protection
    • Fault indication on nFAULT pin
  • Supports 3.3-V, 5-V logic inputs
  • Low sleep current - 1μA typical at 25°C
  • 3 variants - HW (H), SPI (S) or SPI (P)
  • Configurable control modes:
    • Single full bridge using PWM or PH/EN mode
    • Two half-bridges using Independent mode
  • Device family comparison table

The DRV824x-Q1 family of devices is a fully integrated H-bridge driver intended for a wide range of automotive applications. The device can be configured as a single full-bridge driver or as two independent half-bridge drivers. Designed in a BiCMOS high power process technology node, this monolithic family of devices in a power package offer excellent power handling and thermal capability while providing compact package size, ease of layout, EMI control, accurate current sense, robustness, and diagnostic capability. This family provides an identical pin function with scalable RON (current capability) to support different loads.

The devices integrate a N-channel H-bridge, charge pump regulator, high-side current sensing with regulation, current proportional output, and protection circuitry. A low-power sleep mode is provided to achieve low quiescent current. The devices offer voltage monitoring and load diagnostics as well as protection features against over current and over temperature. Fault conditions are indicated on nFAULT pin. The devices are available in three variants - hardwired interface: HW (H) and two SPI interface variants: SPI(P) and SPI(S), with SPI (P) for externally supplied logic supply and SPI (S) for internally generated logic supply. The SPI interface variants offer more flexibility in device configuration and fault observability.