半导体术语中英文对照大全！

半导体产业作为一个起源于国外的技术，很多相关的技术术语都是用英文表述。且由于很多从业者都有海外经历，或者他们习惯于用英文表述相关的工艺和技术节点，那就导致很多的英文术语被翻译为中文之后，很多人不能对照得上，或者不知道怎么翻译。在这里我们整理一些常用的半导体术语的中英文版本，希望对大家有所帮助。如果当中有出错，请帮忙纠正，谢谢！

常用半导体中英对照表

离子注入机  ion implanter

LSS理论  Lindhand Scharff and Schiott theory，又称“林汉德-斯卡夫-斯高特理论”。

沟道效应  channeling effect

射程分布  range distribution

深度分布  depth distribution

投影射程  projected range

阻止距离  stopping distance

阻止本领  stopping power

标准阻止截面  standard stopping cross section

退火  annealing

激活能  activation energy

等温退火  isothermal annealing

激光退火  laser annealing

应力感生缺陷  stress-induced defect

择优取向  preferred orientation

制版工艺  mask-making technology

图形畸变  pattern distortion

初缩  first minification

精缩  final minification

母版  master mask

铬版  chromium plate

干版  dry plate

乳胶版  emulsion plate

透明版  see-through plate

高分辨率版  high resolution plate, HRP

超微粒干版  plate for ultra-microminiaturization

掩模  mask

掩模对准  mask alignment

对准精度  alignment precision

光刻胶  photoresist，又称“光致抗蚀剂”。

负性光刻胶  negative photoresist

正性光刻胶  positive photoresist

无机光刻胶  inorganic resist

多层光刻胶  multilevel resist

电子束光刻胶  electron beam resist

X射线光刻胶  X-ray resist

刷洗  scrubbing

甩胶  spinning

涂胶  photoresist coating

后烘  postbaking

光刻  photolithography

X射线光刻  X-ray lithography

电子束光刻  electron beam lithography

离子束光刻  ion beam lithography

深紫外光刻  deep-UV lithography

***  mask aligner

投影***  projection mask aligner

曝光  exposure

接触式曝光法  contact exposure method

接近式曝光法  proximity exposure method

光学投影曝光法  optical projection exposure method

电子束曝光系统  electron beam exposure system

分步重复系统  step-and-repeat system

显影  development

线宽  linewidth

去胶  stripping of photoresist

氧化去胶  removing of photoresist by oxidation

等离子［体］去胶  removing of photoresist by plasma

刻蚀  etching

干法刻蚀  dry etching

反应离子刻蚀  reactive ion etching,  RIE

各向同性刻蚀  isotropic etching

各向异性刻蚀  anisotropic etching

反应溅射刻蚀  reactive sputter etching

离子铣  ion beam milling，又称“离子磨削”。

等离子［体］刻蚀  plasma etching

钻蚀  undercutting

剥离技术  lift-off technology，又称“浮脱工艺”。

终点监测  endpoint monitoring

金属化  metallization

互连  interconnection

多层金属化  multilevel metallization

电迁徙  electromigration

回流  reflow

磷硅玻璃  phosphorosilicate glass

硼磷硅玻璃  boron-phosphorosilicate glass

钝化工艺  passivation technology

多层介质钝化  multilayer dielectric passivation

划片  scribing

电子束切片  electron beam slicing

烧结  sintering

印压  indentation

热压焊  thermocompression bonding

热超声焊  thermosonic bonding

冷焊  cold welding

点焊  spot welding

球焊  ball bonding

楔焊  wedge bonding

内引线焊接  inner lead bonding

外引线焊接  outer lead bonding

梁式引线  beam lead

装架工艺  mounting technology

附着  adhesion

封装  packaging

金属封装  metallic packaging

陶瓷封装  ceramic packaging

扁平封装  flat packaging

塑封  plastic package

玻璃封装  glass packaging

微封装  micropackaging，又称“微组装”。

管壳  package

管芯  die

引线键合  lead bonding

引线框式键合  lead frame bonding

带式自动键合  tape automated bonding, TAB

激光键合  laser bonding

超声键合  ultrasonic bonding

红外键合  infrared bonding

微电子辞典大集合

（按首字母顺序排序）

A

Abrupt junction 突变结

Accelerated testing 加速实验 

Acceptor 受主 

Acceptor atom 受主原子 

Accumulation 积累、堆积 

Accumulating contact 积累接触 

Accumulation region 积累区 

Accumulation layer 积累层 

Active region 有源区 

Active component 有源元 

Active device 有源器件 

Activation 激活 

Activation energy 激活能 

Active region 有源（放大）区 

Admittance 导纳 

Allowed band 允带 

Alloy-junction device

合金结器件 Aluminum(Aluminium) 铝 

Aluminum – oxide 铝氧化物 

Aluminum passivation 铝钝化 

Ambipolar 双极的

Ambient temperature 环境温度 

Amorphous 无定形的，非晶体的 

Amplifier 功放 扩音器 放大器 

Analogue(Analog) comparator 模拟比较器 Angstrom 埃 

Anneal 退火 

Anisotropic 各向异性的 

Anode 阳极 

Arsenic (AS) 砷 

Auger 俄歇 

Auger process 俄歇过程 

Avalanche 雪崩 

Avalanche breakdown 雪崩击穿 

Avalanche excitation雪崩激发 

B

Background carrier 本底载流子 

Background doping 本底掺杂 

Backward 反向 

Backward bias 反向偏置 

Ballasting resistor 整流电阻 

Ball bond 球形键合 

Band 能带 

Band gap 能带间隙 

Barrier 势垒 

Barrier layer 势垒层 

Barrier width 势垒宽度 

Base 基极 

Base contact 基区接触 

Base stretching 基区扩展效应 

Base transit time 基区渡越时间 

Base transport efficiency基区输运系数 

Base-width modulation基区宽度调制 

Basis vector 基矢 

Bias 偏置 

Bilateral switch 双向开关 

Binary code 二进制代码

Binary compound semiconductor 二元化合物半导体 

Bipolar 双极性的 

Bipolar Junction Transistor (BJT)双极晶体管 

Bloch 布洛赫 

Blocking band 阻挡能带 

Blocking contact 阻挡接触 

Body - centered 体心立方 

Body-centred cubic structure 体立心结构 

Boltzmann 波尔兹曼 

Bond 键、键合 

Bonding electron 价电子 

Bonding pad 键合点 

Bootstrap circuit 自举电路 

Bootstrapped emitter follower 自举射极跟随器

Boron 硼 

Borosilicate glass 硼硅玻璃 

Boundary condition 边界条件 

Bound electron 束缚电子 

Breadboard 模拟板、实验板 

Break down 击穿 

Break over 转折 

Brillouin 布里渊 

Brillouin zone 布里渊区 

Built-in 内建的 

Build-in electric field 内建电场 

Bulk 体/体内 Bulk absorption 体吸收 

Bulk generation 体产生 

Bulk recombination 体复合 

Burn - in 老化 

Burn out 烧毁 

Buried channel 埋沟 

Buried diffusion region 隐埋扩散区 

C

Can 外壳 

Capacitance 电容 

Capture cross section 俘获截面 

Capture carrier 俘获载流子 

Carrier 载流子、载波

Carry bit 进位位 

Carry-in bit 进位输入 

Carry-out bit 进位输出 

Cascade 级联 

Case 管壳 

Cathode 阴极

Center 中心 

Ceramic 陶瓷（的） 

Channel 沟道 

Channel breakdown 沟道击穿

Channel current 沟道电流 

Channel doping 沟道掺杂 

Channel shortening 沟道缩短 

Channel width 沟道宽度 

Characteristic impedance 特征阻抗 

Charge 电荷、充电 

Charge-compensation effects 电荷补偿效应 

Charge conservation 电荷守恒 

Charge neutrality condition 电中性条件 

Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储 

Chemmical etching 化学腐蚀法 

Chemically-Polish 化学抛光 

Chemmically-Mechanically Polish (CMP) 化学机械抛光 Chip 芯片 

Chip yield 芯片成品率 

Clamped 箝位 

Clamping diode 箝位二极管 

Cleavage plane 解理面 

Clock rate 时钟频率 

Clock generator 时钟发生器 

Clock flip-flop 时钟触发器 

Close-packed structure 密堆积结构 

Close-loop gain 闭环增益

Collector 集电极 

Collision 碰撞 

Compensated OP-AMP 补偿运放 

Common-base/collector/emitter connection 共基极/集电极/发射极连接 

Common-gate/drain/source connection 共栅/漏/源连接 

Common-mode gain 共模增益 

Common-mode input 共模输入 

Common-mode rejection ratio (CMRR) 共模抑制比 

Compatibility 兼容性 

Compensation 补偿 

Compensated impurities 补偿杂质 

Compensated semiconductor 补偿半导体 

Complementary Darlington circuit 互补达林顿电路 

Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS) 

互补金属氧化物半导体场效应晶体管 

Complementary error function 余误差函数 

Computer-aided design (CAD)/test(CAT)/manufacture(CAM) 计算机辅助设计/ 测试 /制 

造 

Compound Semiconductor 化合物半导体 

Conductance 电导 

Conduction band (edge) 导带(底) 

Conduction level/state 导带态 

Conductor 导体

Conductivity 电导率 

Configuration 组态

Conlomb 库仑 

Conpled Configuration Devices 结构组态 

Constants 物理常数 

Constant energy surface 等能面 

Constant-source diffusion恒定源扩散 

Contact 接触 

Contamination 治污 

Continuity equation 连续性方程

Contact hole 接触孔 

Contact potential 接触电势 

Continuity condition 连续性条件 

Contra doping 反掺杂 

Controlled 受控的 

Converter 转换器 

Conveyer 传输器 

Copper interconnection system 铜互连系统

Couping 耦合 

Covalent 共阶的 

Crossover 跨交 

Critical 临界的 

Crossunder 穿交 

Crucible坩埚 

Crystal defect/face/orientation/lattice 晶体缺陷/晶面/晶向/晶 

格 

Current density 电流密度

Curvature 曲率 

Cut off 截止 

Current drift/dirve/sharing 电流漂移/驱动/共享 

Current Sense 电流取样 

Curvature 弯曲 

Custom integrated circuit 定制集成电路 

Cylindrical 柱面的 

Czochralshicrystal 直立单晶 

Czochralski technique 切克劳斯基技术（Cz法直拉晶体J） 

D

Dangling bonds 悬挂键 

Dark current 暗电流 

Dead time 空载时间 

Debye length 德拜长度 

De.broglie 德布洛意 

Decderate 减速 

Decibel (dB) 分贝 

Decode 译码 

Deep acceptor level 深受主能级 

Deep donor level 深施主能级 

Deep impurity level 深度杂质能级 

Deep trap 深陷阱 

Defeat 缺陷 

Degenerate semiconductor 简并半导体 

Degeneracy 简并度 

Degradation 退化 

Degree Celsius(centigrade) /Kelvin 摄氏/开氏温度 

Delay 延迟 Density 密度 

Density of states 态密度 

Depletion 耗尽 

Depletion approximation 耗尽近似 

Depletion contact 耗尽接触 

Depletion depth 耗尽深度 

Depletion effect 耗尽效应 

Depletion layer 耗尽层 

Depletion MOS 耗尽MOS 

Depletion region 耗尽区 

Deposited film 淀积薄膜 

Deposition process 淀积工艺 

Design rules 设计规则 

Die 芯片（复数dice） 

Diode 二极管 

Dielectric 介电的 

Dielectric isolation 介质隔离 

Difference-mode input 差模输入 

Differential amplifier 差分放大器 

Differential capacitance 微分电容 

Diffused junction 扩散结 

Diffusion 扩散 

Diffusion coefficient 扩散系数 

Diffusion constant 扩散常数

Diffusivity 扩散率 

Diffusion capacitance/barrier/current/furnace 扩散电容/势垒/电流/炉 

Digital circuit 数字电路 

Dipole domain 偶极畴 

Dipole layer 偶极层 

Direct-coupling 直接耦合 

Direct-gap semiconductor 直接带隙半导体 

Direct transition 直接跃迁 

Discharge 放电 

Discrete component 分立元件 

Dissipation 耗散 

Distribution 分布 

Distributed capacitance 分布电容 

Distributed model 分布模型 

Displacement 位移 Dislocation 位错 

Domain 畴 Donor 施主 

Donor exhaustion 施主耗尽 

Dopant 掺杂剂 

Doped semiconductor 掺杂半导体 

Doping concentration 掺杂浓度 

Double-diffusive MOS(DMOS)双扩散MOS. 

Drift 漂移 Drift field 漂移电场 

Drift mobility 迁移率 

Dry etching 干法腐蚀 

Dry/wet oxidation 干/湿法氧化

Dose 剂量 

Duty cycle 工作周期 

Dual-in-line package （DIP） 双列直插式封装 

Dynamics 动态 

Dynamic characteristics 动态属性 

Dynamic impedance 动态阻抗 

E

Early effect 厄利效应 

Early failure 早期失效 

Effective mass 有效质量 

Einstein relation(ship) 爱因斯坦关系 

Electric Erase Programmable Read Only Memory(E2PROM) 一次性电可擦除只读存储器 

Electrode 电极 

Electrominggratim 电迁移 

Electron affinity 电子亲和势 

Electronic -grade 电子能 

Electron-beam photo-resist exposure 光致抗蚀剂的电子束曝光 

Electron gas 电子气 

Electron-grade water 电子级纯水 

Electron trapping center 电子俘获中心 

Electron Volt (eV) 电子伏 

Electrostatic 静电的

Element 元素/元件/配件 

Elemental semiconductor 元素半导体

Ellipse 椭圆 

Ellipsoid 椭球 

Emitter 发射极 

Emitter-coupled logic 发射极耦合逻辑

Emitter-coupled pair 发射极耦合对 

Emitter follower 射随器 

Empty band 空带 

Emitter crowding effect 发射极集边（拥挤）效应 

Endurance test =life test 寿命测试 

Energy state 能态 

Energy momentum diagram 能量-动量(E-K)图 

Enhancement mode 增强型模式 

Enhancement MOS 增强性

MOS Entefic (低)共溶的 

Environmental test 环境测试 

Epitaxial 外延的 

Epitaxial layer 外延层 

Epitaxial slice 外延片 

Expitaxy 外延 

Equivalent curcuit 等效电路 

Equilibrium majority /minority carriers 平衡多数/少数载流子 

Erasable Programmable ROM (EPROM)可搽取（编程）存储器 

Error function complement 余误差函数 

Etch 刻蚀 

Etchant 刻蚀剂 

Etching mask 抗蚀剂掩模 

Excess carrier 过剩载流子 

Excitation energy 激发能 

Excited state 激发态 

Exciton 激子 

Extrapolation 外推法 

Extrinsic 非本征的 

Extrinsic semiconductor 杂质半导体 

F

Face - centered 面心立方 

Fall time 下降时间 

Fan-in 扇入 

Fan-out 扇出 

Fast recovery 快恢复 

Fast surface states 快界面态 

Feedback 反馈 

Fermi level 费米能级 

Fermi-Dirac Distribution 费米-狄拉克分布 

Femi potential 费米势 

Fick equation 菲克方程（扩散） 

Field effect transistor 场效应晶体管 

Field oxide 场氧化层 

Filled band 满带 

Film 薄膜 

Flash memory 闪烁存储器 

Flat band 平带 

Flat pack 扁平封装 

Flicker noise 闪烁（变）噪声 

Flip-flop toggle 触发器翻转 

Floating gate 浮栅 

Fluoride etch 氟化氢刻蚀 

Forbidden band 禁带 

Forward bias 正向偏置 

Forward blocking /conducting正向阻断/导通 

Frequency deviation noise频率漂移噪声 

Frequency response 频率响应 

Function 函数 

G

Gain 增益 Gallium-Arsenide(GaAs) 砷化钾 

Gamy ray r 射线 

Gate 门、栅、控制极 

Gate oxide 栅氧化层 

Gauss（ian） 高斯 

Gaussian distribution profile 高斯掺杂分布

Generation-recombination 产生-复合 

Geometries 几何尺寸 

Germanium(Ge) 锗 

Graded 缓变的 

Graded (gradual) channel 缓变沟道 

Graded junction 缓变结 

Grain 晶粒 

Gradient 梯度 

Grown junction 生长结 

Guard ring 保护环 

Gummel-Poom model 葛谋-潘 模型 

Gunn - effect 狄氏效应 

H

Hardened device 辐射加固器件 

Heat of formation 形成热 

Heat sink 散热器、热沉 

Heavy/light hole band 重/轻 空穴带 

Heavy saturation 重掺杂 

Hell - effect 霍尔效应 

Heterojunction 异质结 

Heterojunction structure 异质结结构 

Heterojunction Bipolar Transistor（HBT）异质结双极型晶体 

High field property 高场特性 

High-performance MOS.( H-MOS)高性能

MOS. Hormalized 归一化 

Horizontal epitaxial reactor 卧式外延反应器 

Hot carrior 热载流子 

Hybrid integration 混合集成 

I

Image - force 镜象力 

Impact ionization 碰撞电离 

Impedance 阻抗 

Imperfect structure 不完整结构 

Implantation dose 注入剂量 

Implanted ion 注入离子 

Impurity 杂质

Impurity scattering 杂志散射 

Incremental resistance 电阻增量（微分电阻）

In-contact mask 接触式掩模 

Indium tin oxide (ITO) 铟锡氧化物 

Induced channel 感应沟道 

Infrared 红外的 

Injection 注入 

Input offset voltage 输入失调电压 

Insulator 绝缘体 

Insulated Gate FET(IGFET)绝缘栅

FET Integrated injection logic集成注入逻辑 

Integration 集成、积分 

Interconnection 互连 

Interconnection time delay 互连延时 

Interdigitated structure 交互式结构 

Interface 界面 

Interference 干涉 

International system of unions国际单位制 

Internally scattering 谷间散射 

Interpolation 内插法 

Intrinsic 本征的 

Intrinsic semiconductor 本征半导体 

Inverse operation 反向工作 

Inversion 反型 

Inverter 倒相器 

Ion 离子

Ion beam 离子束 

Ion etching 离子刻蚀 

Ion implantation 离子注入 

Ionization 电离 

Ionization energy 电离能 

Irradiation 辐照 

Isolation land 隔离岛 

Isotropic 各向同性 

J

Junction FET(JFET) 结型场效应管 

Junction isolation 结隔离 

Junction spacing 结间距 

Junction side-wall 结侧壁 

L

Latch up 闭锁 

Lateral 横向的 

Lattice 晶格 

Layout 版图 

Lattice binding/cell/constant/defect/distortion 晶格结合力/晶胞/晶格/晶格常熟 

/晶格缺陷/晶格畸变 

Leakage current （泄）漏电流 

Level shifting 电平移动 

Life time 寿命 

linearity 线性度 

Linked bond 共价键 

Liquid Nitrogen 液氮 

Liquid－phase epitaxial growth technique 液相外延生长技术 

Lithography 光刻 

Light Emitting Diode(LED) 发光二极管 

Load line or Variable 负载线 

Locating and Wiring 布局布线 

Longitudinal 纵向的 

Logic swing 逻辑摆幅 

Lorentz 洛沦兹 

Lumped model 集总模型 

M

Majority carrier 多数载流子 

Mask 掩膜板，光刻板 

Mask level 掩模序号 

Mask set 掩模组 

Mass - action law质量守恒定律

Master-slave D flip-flop主从D触发器 

Matching 匹配 

Maxwell 麦克斯韦 

Mean free path 平均自由程 

Meandered emitter junction梳状发射极结 

Mean time before failure (MTBF) 平均工作时间 

Megeto - resistance 磁阻 

Mesa 台面 

MESFET-Metal Semiconductor金属半导体FET 

Metallization 金属化 

Microelectronic technique 微电子技术 

Microelectronics 微电子学 

Millen indices 密勒指数 

Minority carrier 少数载流子 

Misfit 失配 

Mismatching 失配 

Mobile ions 可动离子 

Mobility 迁移率 

Module 模块 

Modulate 调制 

Molecular crystal分子晶体 

Monolithic IC 单片IC MOSFET金属氧化物半导体场效应晶体管 

Mos. Transistor(MOST )MOS. 晶体管 

Multiplication 倍增 

Modulator 调制 

Multi-chip IC 多芯片IC 

Multi-chip module(MCM) 多芯片模块 

Multiplication coefficient倍增因子 

N

Naked chip 未封装的芯片（裸片） 

Negative feedback 负反馈 

Negative resistance 负阻 

Nesting 套刻 

Negative-temperature-coefficient 负温度系数 

Noise margin 噪声容限 

Nonequilibrium 非平衡 

Nonrolatile 非挥发（易失）性 

Normally off/on 常闭/开 

Numerical analysis 数值分析 

O

Occupied band 满带 

Officienay 功率 

Offset 偏移、失调 

On standby 待命状态 

Ohmic contact 欧姆接触 

Open circuit 开路 

Operating point 工作点 

Operating bias 工作偏置 

Operational amplifier (OPAMP)运算放大器 

Optical photon =photon 光子 

Optical quenching光猝灭 

Optical transition 光跃迁 

Optical-coupled isolator光耦合隔离器 

Organic semiconductor有机半导体 

Orientation 晶向、定向 

Outline 外形 

Out-of-contact mask非接触式掩模 

Output characteristic 输出特性 

Output voltage swing 输出电压摆幅 

Overcompensation 过补偿 

Over-current protection 过流保护 

Over shoot 过冲 

Over-voltage protection 过压保护 

Overlap 交迭 

Overload 过载 

Oscillator 振荡器 

Oxide 氧化物 

Oxidation 氧化 

Oxide passivation 氧化层钝化 

P

Package 封装

Pad 压焊点 

Parameter 参数 

Parasitic effect 寄生效应 

Parasitic oscillation 寄生振荡 

Passination 钝化 

Passive component 无源元件 

Passive device 无源器件 

Passive surface 钝化界面 

Parasitic transistor 寄生晶体管 

Peak-point voltage 峰点电压 

Peak voltage 峰值电压 

Permanent-storage circuit 永久存储电路 

Period 周期 

Periodic table 周期表 

Permeable - base 可渗透基区 

Phase-lock loop 锁相环

Phase drift 相移 

Phonon spectra 声子谱 

Photo conduction 光电导

Photo diode 光电二极管 

Photoelectric cell 光电池 

Photoelectric effect 光电效应 

Photoenic devices 光子器件 

Photolithographic process 光刻工艺 

(photo) resist （光敏）抗腐蚀剂 

Pin 管脚 

Pinch off 夹断 

Pinning of Fermi level 费米能级的钉扎（效应） 

Planar process 平面工艺 

Planar transistor 平面晶体管 

Plasma 等离子体 

Plezoelectric effect 压电效应 

Poisson equation 泊松方程 

Point contact 点接触 

Polarity 极性 

Polycrystal 多晶 

Polymer semiconductor聚合物半导体 

Poly-silicon 多晶硅 

Potential (电)势 

Potential barrier 势垒 

Potential well 势阱 

Power dissipation 功耗 

Power transistor 功率晶体管 

Preamplifier 前置放大器 

Primary flat 主平面 

Principal axes 主轴 

Print-circuit board(PCB) 印制电路板 

Probability 几率 

Probe 探针 

Process 工艺 

Propagation delay 传输延时 

Pseudopotential method 膺势发 

Punch through 穿通 

Pulse triggering/modulating 脉冲触发/调制Pulse 

Widen Modulator(PWM) 脉冲宽度调制 

Punchthrough 穿通 

Push-pull stage 推挽级 

Q

Quality factor 品质因子 

Quantization 量子化 

Quantum 量子 

Quantum efficiency量子效应 

Quantum mechanics 量子力学 

Quasi – Fermi－level准费米能级 

Quartz 石英 

R

Radiation conductivity 辐射电导率 

Radiation damage 辐射损伤 

Radiation flux density 辐射通量密度 

Radiation hardening 辐射加固 

Radiation protection 辐射保护 

Radiative - recombination辐照复合 

Radioactive 放射性 

Reach through 穿通 

Reactive sputtering source 反应溅射源 

Read diode 里德二极管 

Recombination 复合 

Recovery diode 恢复二极管 

Reciprocal lattice 倒核子 

Recovery time 恢复时间 

Rectifier 整流器（管） 

Rectifying contact 整流接触 

Reference 基准点 基准 参考点 

Refractive index 折射率 

Register 寄存器 

Registration 对准 

Regulate 控制 调整 

Relaxation lifetime 驰豫时间 

Reliability 可靠性 

Resonance 谐振 

Resistance 电阻 

Resistor 电阻器 

Resistivity 电阻率 

Regulator 稳压管（器） 

Relaxation 驰豫 

Resonant frequency共射频率 

Response time 响应时间 

Reverse 反向的 

Reverse bias 反向偏置 

S

Sampling circuit 取样电路 

Sapphire 蓝宝石（Al2O3） 

Satellite valley 卫星谷 

Saturated current range电流饱和区 

Saturation region 饱和区

Saturation 饱和的 

Scaled down 按比例缩小 

Scattering 散射 

Schockley diode 肖克莱二极管 

Schottky 肖特基 

Schottky barrier 肖特基势垒 

Schottky contact 肖特基接触 

Schrodingen 薛定厄 

Scribing grid 划片格 

Secondary flat 次平面 

Seed crystal 籽晶 

Segregation 分凝 

Selectivity 选择性 

Self aligned 自对准的 

Self diffusion 自扩散 

Semiconductor 半导体 

Semiconductor-controlled rectifier 可控硅 

Sendsitivity 灵敏度 

Serial 串行/串联 

Series inductance 串联电感 

Settle time 建立时间 

Sheet resistance 薄层电阻 

Shield 屏蔽

Short circuit 短路 

Shot noise 散粒噪声

Shunt 分流 

Sidewall capacitance 

边墙电容 Signal 信号 

Silica glass 石英玻璃 

Silicon 硅 

Silicon carbide 碳化硅 

Silicon dioxide (SiO2) 二氧化硅 

Silicon Nitride(Si3N4) 氮化硅 

Silicon On Insulator 绝缘硅 

Siliver whiskers 银须 

Simple cubic 简立方 

Single crystal 单晶 

Sink 沉 

Skin effect 趋肤效应 

Snap time 急变时间 

Sneak path 潜行通路 

Sulethreshold 亚阈的 

Solar battery/cell 太阳能电池 

Solid circuit 固体电路 

Solid Solubility 固溶度 

Sonband 子带 

Source 源极 

Source follower 源随器 

Space charge 空间电荷 

Specific heat(PT) 热 

Speed-power product 速度功耗乘积 Spherical 球面的 

Spin 自旋 Split 分裂 

Spontaneous emission 自发发射 

Spreading resistance扩展电阻 

Sputter 溅射 Stacking fault 层错 

Static characteristic 静态特性 

Stimulated emission 受激发射 

Stimulated recombination 受激复合 

Storage time 存储时间 

Stress 应力 

Straggle 偏差 

Sublimation 升华 

Substrate 衬底 

Substitutional 替位式的 

Superlattice 超晶格 

Supply 电源 Surface 表面 

Surge capacity 浪涌能力 

Subscript 下标 

Switching time 开关时间 

Switch 开关 

T

Tailing 扩展 

Terminal 终端 

Tensor 张量 Tensorial 张量的 

Thermal activation 热激发 

Thermal conductivity 热导率 

Thermal equilibrium 热平衡 

Thermal Oxidation 热氧化 

Thermal resistance 热阻 

Thermal sink 热沉 

Thermal velocity 热运动 

Thermoelectricpovoer 温差电动势率 

Thick-film technique 厚膜技术 

Thin-film hybrid IC薄膜混合集成电路 

Thin-Film Transistor(TFT) 薄膜晶体 

Threshlod 阈值 

Thyistor 晶闸管 

Transconductance 跨导 

Transfer characteristic 转移特性 

Transfer electron 转移电子 

Transfer function 传输函数 Transient 瞬态的 

Transistor aging(stress) 晶体管老化 

Transit time 渡越时间 

Transition 跃迁 

Transition-metal silica 过度金属硅化物 

Transition probability 跃迁几率 

Transition region 过渡区 

Transport 输运 Transverse 横向的 

Trap 陷阱 Trapping 俘获 

Trapped charge 陷阱电荷 

Triangle generator 三角波发生器 

Triboelectricity 摩擦电

Trigger 触发 

Trim 调配 调整 

Triple diffusion 三重扩散 

Truth table 真值表 

Tolerahce 容差 

Tunnel(ing) 隧道（穿） 

Tunnel current 隧道电流 

Turn over 转折 

Turn - off time 关断时间 

U

Ultraviolet 紫外的 

Unijunction 单结的 

Unipolar 单极的 

Unit cell 原（元）胞 

Unity-gain frequency 单位增益频率 

Unilateral-switch单向开关 

V

Vacancy 空位 Vacuum 真空 

Valence(value) band 价带 Value band edge 价带顶 

Valence bond 价键 Vapour phase 汽相 

Varactor 变容管 Varistor 变阻器 

Vibration 振动 Voltage 电压 

W

Wafer 晶片 

Wave equation 波动方程 

Wave guide 波导 

Wave number 波数 

Wave-particle duality 波粒二相性 

Wear-out 烧毁 

Wire routing 布线 

Work function 功函数 

Worst-case device 最坏情况器件 

Y

Yield 成品率 

Z

Zener breakdown 齐纳击穿 

Zone melting 区熔法