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SI4702/03-c19对于便携式应用调频广播收音机调谐器

消耗积分:0 | 格式:rar | 大小:1.65 MB | 2017-09-26

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  The Si4702/03-C19 extends Silicon Laboratories Si4700/01 FM tuner family, and further increases the ease and attractiveness of adding FM radio reception to mobile devices through small size and board area, minimum component count, flexible programmability, and superior, proven performance. Si4702/03-C19 software is backwards compatible to existing Si4700/01 and Si4702/03-B16 FM Tuner designs. The Si4702/03-C19 benefits from proven digital integration and 100% CMOS process technology, resulting in a completely integrated solution. It is the industry‘s smallest footprint FM tuner IC requiring only 10 mm2 board space and one external bypass capacitor. The device offers significant programmability, and caters to the subjective nature of FM listeners and variable FM broadcast environments world-wide through a simplified programming interface and mature functionality. The Si4703-C incorporates a digital processor for the European Radio Data System (RDS) and the US Radio Broadcast Data System (RBDS) including all required symbol decoding, block synchronization, error detection, and error correction functions. RDS enables data such as station identification and song name to be displayed to the user. The Si4703-C offers a detailed RDS view and a standard view, allowing adopters to selectively choose granularity of RDS status, data, and block errors. Si4703-C software is backwards compatible to the proven Si4701, adopted by leading cell-phone and MP3 manufacturers world-wide. The Si4702/03-C19 is based on the superior, proven performance of Silicon Laboratories’ Aero architecture offering unmatched interference rejection and leading sensitivity. The device uses the same programming interface as the Si4701 and supports multiple bus-modes. Power management is also simplified with an integrated regulator allowing direct connection to a 2.7 to 5.5 V battery. The Si4702/03-C19 device’s high level of integration and complete FM system production testing increases quality to manufacturers, improves device yields, and simplifies device manufacturing and final testing.
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