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网络通讯微处理器XPC850 (Rev 0.3)、XPC86
消耗积分:5 |
格式:rar |
大小:133 |
2009-06-24
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This report summarizes the reliability data for Motorola communication
microprocessors fabricated on the 0.42m single polysilicon process in our wafer
fabrication facility, Mos 11, in Austin, Texas. The current devices fabricated using this process are given in the table below.
All of these devices are currently in their XC phase of product life, which is the
time when design errata are discovered and corrected. Although the 850 and 860 are still classified as XC devices, they are built using production equipment and processes, and have completed their reliability qualifications. There are some functional errata on these devices, which may impact some customers. These errata are expected to be corrected in revision D of the 860, which we expect to grant MC status to. For a list of current design errata on these devices, please contact your local Motorola sales person. To locate the nearest sales office, you can find them on our website at http://mot-sps.com/sales/ sales_web.html.
microprocessors fabricated on the 0.42m single polysilicon process in our wafer
fabrication facility, Mos 11, in Austin, Texas. The current devices fabricated using this process are given in the table below.
All of these devices are currently in their XC phase of product life, which is the
time when design errata are discovered and corrected. Although the 850 and 860 are still classified as XC devices, they are built using production equipment and processes, and have completed their reliability qualifications. There are some functional errata on these devices, which may impact some customers. These errata are expected to be corrected in revision D of the 860, which we expect to grant MC status to. For a list of current design errata on these devices, please contact your local Motorola sales person. To locate the nearest sales office, you can find them on our website at http://mot-sps.com/sales/ sales_web.html.
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