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The Future of In-Circuit Testi
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2010-08-04
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The effectiveness of in-circuit test (ICT) was never chal-
lenged for the past 20 years of its reign as the center of
printed circuit board assembly (PCBA) test strategy for
many electronics manufacturers. However, the reign of
ICT on the manufacturing fl oor is facing growing threat
with the increasing popularity of low voltage differential
signaling (LVDS) integrated circuits used for high speed
differential signaling, and ball grid array (BGA) devices. And
as pin counts increase to try and keep up with Moore’s Law
predicting that the number of transistors in the integrated
circuit will double every two years, ICT capabilities will be
stretched even further.
lenged for the past 20 years of its reign as the center of
printed circuit board assembly (PCBA) test strategy for
many electronics manufacturers. However, the reign of
ICT on the manufacturing fl oor is facing growing threat
with the increasing popularity of low voltage differential
signaling (LVDS) integrated circuits used for high speed
differential signaling, and ball grid array (BGA) devices. And
as pin counts increase to try and keep up with Moore’s Law
predicting that the number of transistors in the integrated
circuit will double every two years, ICT capabilities will be
stretched even further.
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