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表面组装印制板前期设计的优化

消耗积分:0 | 格式:rar | 大小:1923 | 2010-11-26

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 在影响表面贴装焊接质量因素中，表面组装印制板（SMB）的前期设计往往被设计人员所忽视，由此产生的问题通常在大批量生产过程中才会逐渐暴露出来。为此从SMC/SMD元器件、组装方式、印制板基材的选择和PCB板的工艺设计规则四个方面进行分析，将工艺要求在设计初期就融入到SMB的设计中去。针对生产中遇到的元器件替换、板材变形、贴片精度以及焊接缺陷等问题，在初期设计就给出了解决方法。同时就初期设计不合理造成的焊接质量缺陷进行讨论,分析了其产生的原因，并提出相应的对策。
Abstract:
 In many factors which affect the quality of surface mount technology（SMT）, the early design of Surface Mount Board（SMB） is the one which is always ignored. And the influences caused by this factor will be exposed gradually during the process of batch production. This paper analyzed from four parts，the choice of Surface Mount Component（SMC）/ Surface Mount Device（SMD），assembly mode，PCB Base Materials and the design rules of PCB，to integrate the technology requirements into the SMBs early design. Aiming at the problems which existed in the process of production, such as component’s replacement, boards soldering deformation, SMT precision and soldering defects, this paper gave the solution in the early design, and not only discussed the defects of soldering quality which caused by the early defective design, but also proposed the corresponding countermeasures.
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