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XAPP427-实施和无铅封装的回流焊指南

消耗积分:0 | 格式:pdf | 大小:71 KB | 2012-02-16

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Recent legislative directives and corporate driven initiatives around the world have called forthe elimination of Pb and other hazardous substances in electronics used in many sectors ofthe electronics industry. The Pb-free program at Xilinx was established in 1999 as a proactiveeffort to develop and qualify suitable material sets and processes for Pb-free applications.Xilinx has taken the leadership position by quickly forming partnerships with our customers,suppliers, and participating in industry consortiums to provide technical solutions that arealigned with industry requirements.
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