资料下载
×
CADENCE SIP DIGITAL ARCHITECT
消耗积分:0 |
格式:rar |
大小:555 |
2008-10-16
hvvvvvvh
分享资料个
CADENCE SIP DIGITAL ARCHITECT
System-in-package (SiP) implementation poses new hurdles for system architects
and designers. Increasing the number of IC die not only introduces more overall
complexity, but these die sharing the same power grid within a package substrate
also makes power delivery more complex. To address these and other challenges,
Cadence
SiP Digital Architect provides a unique environment to explore, define,
and optimize system connectivity and functionality between ICs, SiP substrates,
and target printed circuit board (PCB) systems.
System-in-package (SiP) implementation poses new hurdles for system architects
and designers. Increasing the number of IC die not only introduces more overall
complexity, but these die sharing the same power grid within a package substrate
also makes power delivery more complex. To address these and other challenges,
Cadence
SiP Digital Architect provides a unique environment to explore, define,
and optimize system connectivity and functionality between ICs, SiP substrates,
and target printed circuit board (PCB) systems.
声明：本文内容及配图由入驻作者撰写或者入驻合作网站授权转载。文章观点仅代表作者本人，不代表电子发烧友网立场。文章及其配图仅供工程师学习之用，如有内容侵权或者其他违规问题，请联系本站处理。 举报投诉
评论(0)
发评论
- 相关下载
- 相关文章
