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SO-8封装热阻抗的考虑（器件涉及EL2120C）
消耗积分:5 |
格式:rar |
大小:103 |
2009-06-03
362163
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The world owes Phillips and Signetics a great
debt in introducing the SO package. It offers a
very small footprint, low cost, reliable, surface
mounting package demanded by today's high
density systems. However, since the thermal impedance
of any package is, to the first order, inversely
proportional to its area, the SO-8 imposes
severe restrictions on the allowable power dissipation
of the package. As pointed out in Reference
(1), power dissipation raises the die junction
temperature, and system reliability may be degraded.
This brief sets forth a practical design
method to ascertain what, if any, restrictions
have to be placed on operating a linear IC in the
SO package.
debt in introducing the SO package. It offers a
very small footprint, low cost, reliable, surface
mounting package demanded by today's high
density systems. However, since the thermal impedance
of any package is, to the first order, inversely
proportional to its area, the SO-8 imposes
severe restrictions on the allowable power dissipation
of the package. As pointed out in Reference
(1), power dissipation raises the die junction
temperature, and system reliability may be degraded.
This brief sets forth a practical design
method to ascertain what, if any, restrictions
have to be placed on operating a linear IC in the
SO package.
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