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飞利浦TDA1308A数据资料
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2009-08-18
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飞利浦TDA1308A数据资料:This document contains information about the wafer level chip scale package
(CSP) version of the TDA1308A.
The CSP package is denoted as TDA1308AUK.
Special considerations are needed to ensure a reliable mounting and
manufacturing process of the CSP. Extensive testing and DOE (Design Of
Experiments) will be necessary in order to develop a successful process.
Package Description
The TDA1308 is an 8-bump CSP device close to the size of a 0402 chip cap.
(Figure 1 & 2; Approximate dimensions overall = 0.033” x 0.026”)
(CSP) version of the TDA1308A.
The CSP package is denoted as TDA1308AUK.
Special considerations are needed to ensure a reliable mounting and
manufacturing process of the CSP. Extensive testing and DOE (Design Of
Experiments) will be necessary in order to develop a successful process.
Package Description
The TDA1308 is an 8-bump CSP device close to the size of a 0402 chip cap.
(Figure 1 & 2; Approximate dimensions overall = 0.033” x 0.026”)
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