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NXP微控制器BGA封装的PCB布线指南

消耗积分:0 | 格式:rar | 大小:0.27 MB | 2017-09-29

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  The plastic Ball Grid Array (BGA), including Low-profile Ball Grid Array (LBGA), Lowprofile Fine pitch BGA (LFBGA) and Thin-profile Fine pitch BGA (TFBGA) packages have

  become, for many applications, the first choice for designers requiring medium to high

  pin-count IC packaging. For this reason many of the LPC Family of Microcontrollers are

  available in the LBGA, LFBGA or TFBGA package.

  When comparing it to other common alternative packages, such as the Quad Flat Pack

  (QFP), the (L)(LF)(TF)BGA device has many advantages, such as:

NXP微控制器BGA封装的PCB布线指南

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