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Agilent EEsof EDA W2342 FEM Si
消耗积分:3 |
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大小:193 |
2010-08-11
陈文博
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The Agilent FEM simulator element provides full wave 3D electromagnetic simulation
capabilities to both EMPro and the Advanced Design System (ADS). ADS is the only design
simulation platform that enables the co-design of IC, package, and board in high-frequency and
high-speed applications. It seamlessly integrates system, circuit, and full 3D electromagnetic
simulation with Agilent’s test instrumentation, resulting in repeatable, fi rst-pass electronic
design success.
FEM simulator is Agilent’s second-generation, fi nite-element method (FEM), 3D electromagnetic
simulator. It is integrated into the ADS design fl ow to enable seamless co-simulation of
arbitrary 3D structures such as connectors, wirebonds, and packaging with circuit and
system components. This allows effects of 3D components previously diffi cult or tedious
to include in a design simulation to be naturally accounted for without leaving the circuit design
fl ow. It is especially convenient for RF module designs where 3D interconnects
and packaging must be simulated along with the circuit.
capabilities to both EMPro and the Advanced Design System (ADS). ADS is the only design
simulation platform that enables the co-design of IC, package, and board in high-frequency and
high-speed applications. It seamlessly integrates system, circuit, and full 3D electromagnetic
simulation with Agilent’s test instrumentation, resulting in repeatable, fi rst-pass electronic
design success.
FEM simulator is Agilent’s second-generation, fi nite-element method (FEM), 3D electromagnetic
simulator. It is integrated into the ADS design fl ow to enable seamless co-simulation of
arbitrary 3D structures such as connectors, wirebonds, and packaging with circuit and
system components. This allows effects of 3D components previously diffi cult or tedious
to include in a design simulation to be naturally accounted for without leaving the circuit design
fl ow. It is especially convenient for RF module designs where 3D interconnects
and packaging must be simulated along with the circuit.
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