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射频电路应用设计的关键性课题
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2009-05-07
张生
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射频电路应用设计的关键性课题:1. Interference and Isolation
o Existence of Interference in Circuitry
o Definition and Measurement of Isolation
o Main Path of Interference in a RF Module
o Main Path of Interference in a IC Die
2. Shielding for a RF Module by a Metallic Shielding Box
3. Strong Desirability to Develop RFIC
4. Interference Going Along IC Substrate Path
o Experimentation
o Trench
o Guard Ring
5. Solution for Interference Coming from the Sky
6. Common Grounding Rules for RF Module and RFIC Design
o Grounding of Circuit-branches or Blocks in Parallel
o DC Power Supply to Circuit-branches or Blocks in Parallel
7. Bottlenecks in RFIC
o Low Q Inductor and Possible Solution
o “Zero” Capacitors
o Bonding Wires
8. Prospect of SOC
9. What is Next?
Appendixes
o Notes about RFIC layout
o Calculation of Quarter Wavelength
o Progress of Electronic Industry
o Existence of Interference in Circuitry
o Definition and Measurement of Isolation
o Main Path of Interference in a RF Module
o Main Path of Interference in a IC Die
2. Shielding for a RF Module by a Metallic Shielding Box
3. Strong Desirability to Develop RFIC
4. Interference Going Along IC Substrate Path
o Experimentation
o Trench
o Guard Ring
5. Solution for Interference Coming from the Sky
6. Common Grounding Rules for RF Module and RFIC Design
o Grounding of Circuit-branches or Blocks in Parallel
o DC Power Supply to Circuit-branches or Blocks in Parallel
7. Bottlenecks in RFIC
o Low Q Inductor and Possible Solution
o “Zero” Capacitors
o Bonding Wires
8. Prospect of SOC
9. What is Next?
Appendixes
o Notes about RFIC layout
o Calculation of Quarter Wavelength
o Progress of Electronic Industry
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