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AD8079,pdf datasheet (Dual 260
消耗积分:3 |
格式:rar |
大小:547 |
2009-09-02
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The maximum power that can be safely dissipated by the
AD8079 is limited by the associated rise in junction temperature.
The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition temperature
of the plastic, approximately +150°C. Exceeding this
limit temporarily may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of +175°C for an extended
period can result in device failure.
AD8079 is limited by the associated rise in junction temperature.
The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition temperature
of the plastic, approximately +150°C. Exceeding this
limit temporarily may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of +175°C for an extended
period can result in device failure.
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