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热阻计算方法(Thermal Resistance calculation)

消耗积分:0 | 格式:exe | 大小:233 KB | 2011-03-17

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The heat caused by the power loss Ptot in the active semiconductor region during
operation results in an increased temperature of the component. The heat is dissipated
from its source (junction J or channel Ch) via the chip, the case and the substrate (pc
board) to the heat sink (ambient A). The junction temperature TJ at an ambient
temperature TA is determined by the thermal resistance RthJA and the power dissipation。

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