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微器件自动装配系统的定标和操纵设计
王超
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微器件自动装配系统的定标和操纵设计
主要研究了自动微器件装配系统的定标技术和操纵策略两个问题. 在加入了尺度因子优化步骤之后,一种基于Tsai 两步法的自定标方法实现了亚微米级的定标精度,并且获得了更加可信的定标角度参数. 这种定标方法应用于微器件装配系统中并可以实现高精度的微器件定位. 除了精确定标之外,我们还应该选择合适的工作环境来控制粘附力的大小来提高微器件操纵成功率,选择合适的夹持和释放方式来提高微器件操纵效率和释放位置精度,选择一种安全简单的移动路径来缩短移动时间. 实验表明,我们的自动微器件装配系统可以在10 s 内完成一个器件的定位和移动操作,并实现数微米的释放位置精度.
:An automated micro assembly system is presented here. A new self2calibration method with scale factor optimization steps based on Tsai ’s two stage algorithm is applied to calibrate our system. Sub2micron in plane cali bration accuracy and more believable calibration angles can be achieved by our calibration method. A suitable envi2 ronment may facilitate the handling operation because the adhesion forces between micro object s are affected by en vironmental parameters obviously. The pick and release strategies also affect the handling efficiency and micro ob ject positioning accuracy. More attention should be paid on them. Our automated micro assembly system can locate and handle a micro part within 10 seconds with a positioning accuracy of several microns.
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