资料下载
高功率LED应用中的热管理设计技巧
分享资料个
application up to 400 mA, with a super high flux output and
presented in a compact package outline. (6.0 x 6.0 x 1.5).
With its low package height of 1.5 mm it presents the best
combination of compactness and highest brightness.
The following application note details product specification
in corresponding data sheets for the different series of the
product.
The InGaN based devices are casted with silicone. Silicone
casting has big advantages in terms of optical stability and
stress relief, but requires a special handling procedure in
assembly.
For the solder process there is no special requirement. The
device is compatible to the existing SMT processes and
standard IR-reflow.
声明：本文内容及配图由入驻作者撰写或者入驻合作网站授权转载。文章观点仅代表作者本人，不代表电子发烧友网立场。文章及其配图仅供工程师学习之用，如有内容侵权或者其他违规问题，请联系本站处理。 举报投诉
- 相关下载
- 相关文章
