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Package lead inductance consid
消耗积分:3 |
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大小:444 |
2009-03-30
丁冬芹
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A circuits become faster, more concern needs to be focused on
packaging and interconnects in order to fully utilize device
performance. One area of concern is with the package leads
between the chip and the board environment. The current flowing
into or out of an integrated circuit is conducted through a lead frame
trace and bonding wire connecting the integrated circuit to outside
circuitry. these leads are circuit elements, inductors, and have a
definite effect on the circuit performance because they generate
noise in high-speed applications.
Inductance is the measure of change in the magnetic field
surrounding a conductor resulting form the variation of the current
flowing through the conductor. The change in current through the
inductor induces a counter electromotive force, EMF, which opposes
that change in current.
packaging and interconnects in order to fully utilize device
performance. One area of concern is with the package leads
between the chip and the board environment. The current flowing
into or out of an integrated circuit is conducted through a lead frame
trace and bonding wire connecting the integrated circuit to outside
circuitry. these leads are circuit elements, inductors, and have a
definite effect on the circuit performance because they generate
noise in high-speed applications.
Inductance is the measure of change in the magnetic field
surrounding a conductor resulting form the variation of the current
flowing through the conductor. The change in current through the
inductor induces a counter electromotive force, EMF, which opposes
that change in current.
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