资料下载
Leadless Leadframe Package
951414
分享资料个
The Leadless Leadframe Package （LLP） is a leadframe based chip scale package （CSP） that may enhance chip speed， reduce thermal impedance， and reduce the printed circuit board area required for mounting. The small size and very low profile make this package ideal for high density PCBs used in small-scale electronic applications such as cellular phones， pagers， and handheld PDAs. The LLP package is offered in the Pullback and no Pullback configuration. In the Pullback configuration the standard solder pads are offset from the edge of the package by 0.1 mm. In the no Pullback configuration the standard solder pads extend and terminate at the edge of the package. This feature offers a visible solder fillet after board mounting. The LLP has the following advantages： • Low thermal resistance • Reduced electrical parasitics • Improved board space efficiency • Reduced package height • Reduced package mass JEDEC Registration Information： • Quad LLP Packages： MO-220 • Dual-in-line LLP Packages： MO-229
声明：本文内容及配图由入驻作者撰写或者入驻合作网站授权转载。文章观点仅代表作者本人，不代表电子发烧友网立场。文章及其配图仅供工程师学习之用，如有内容侵权或者其他违规问题，请联系本站处理。 举报投诉
- 相关下载
- 相关文章
