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Introduction
This Application Note provides recommendations for handling， storing and mounting of National Semiconductor’s surface mount IC packages.
The final manufacturing yield and board level reliability are influenced by various factors and processes outside the control of the IC manufacturer. This Application Note can therefore only be used as a guideline and reference to support our customers. Due to the variety of possible board assembly materials and equipments， National Semiconductor Corporation （NSC） advises the user to consult the individual suppliers and vendors to achieve the optimum board assembly yield.
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