OMAP3530 and OMAP3525 high-performance, applications processors are based on the enhanced OMAP™ 3 architecture. The OMAP™ 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:
- Streaming video
- 2D/3D mobile gaming
- Video conferencing
- High-resolution still image
- Video capture in 2.5G wireless terminals, 3G wireless terminals, and rich multimedia-featured handsets, and high-performance personal digital assistants (PDAs).
The device supports high-level operating systems (OSs), such as:
- Windows CE
- Symbian OS
- Linux
- Palm OS
This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.
The following subsystems are part of the device:
- Microprocessor unit (MPU) subsystem based on the ARM Cortex™-A8 microprocessor
- IVA2.2 subsystem with a C64x+ digital signal processor (DSP) core
- SGX530 subsystem for 2D and 3D graphics acceleration to support display and gaming effects (3530 only)
- Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
- Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out.
- Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals
The device also offers:
- A comprehensive power and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex™ adaptative voltage control. This power management technique for automatic control of the operating voltage of a module reduces the active power consumption.
- Memory stacking feature using the package-on-package (POP) implementation (CBB package only)
OMAP3530/25 devices are available in a 515-pin PBGA package (CBB suffix) and a 423-pin PBGA package (CUS suffix). Some features of the CBB package are not available in the CUS package.
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