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板级应用笔记的DFN和QFN封装
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2009-04-27
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Various ON Semiconductor components are packaged in an advanced Dual or Quad Flat−Pack No−Lead package (DFN/QFN). The DFN/QFN platform represents the latest
in surface mount packaging technology, it is important that the design of the Mounting Pads of the Printed Circuit Board (PCB), Soldermask and Stencil pattern, along with the
assembly process, all follow the suggested guidelines outlined in this document.
in surface mount packaging technology, it is important that the design of the Mounting Pads of the Printed Circuit Board (PCB), Soldermask and Stencil pattern, along with the
assembly process, all follow the suggested guidelines outlined in this document.
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