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使用新电源模块改进表面贴装可制造性
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2010-11-16
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The latest generation of Texas Instruments (TI) boardmounted
power modules utilizes a pin interconnect technology
that improves surface-mount manufacturability.
These modules are produced as a double-sided surfacemount
(DSSMT) subassembly, yielding a case-less construction
with subcomponents located on both sides of the
printed circuit board (PCB). Products produced in the
DSSMT outline use the latest high-efficiency topologies
and magnetic-component packaging. This provides
customers with a high-efficiency, ready-to-use switching
power module in a compact, space-saving package. Both
nonisolated point-of-load (POL) switching regulators and
the isolated dc/dc converter modules are being produced
in the DSSMT outline.
TI’s plug-in power product line offers power modules in
both through-hole and surface-mount packages. The surfacemount
modules produced in the DSSMT outline use a
solid copper interconnect with an integral solder ball for
their
power modules utilizes a pin interconnect technology
that improves surface-mount manufacturability.
These modules are produced as a double-sided surfacemount
(DSSMT) subassembly, yielding a case-less construction
with subcomponents located on both sides of the
printed circuit board (PCB). Products produced in the
DSSMT outline use the latest high-efficiency topologies
and magnetic-component packaging. This provides
customers with a high-efficiency, ready-to-use switching
power module in a compact, space-saving package. Both
nonisolated point-of-load (POL) switching regulators and
the isolated dc/dc converter modules are being produced
in the DSSMT outline.
TI’s plug-in power product line offers power modules in
both through-hole and surface-mount packages. The surfacemount
modules produced in the DSSMT outline use a
solid copper interconnect with an integral solder ball for
their
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