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fe014管脚功能及技术特性

消耗积分:0 | 格式:rar | 大小:1.72 MB | 2017-10-17

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  Third generation Power MOSFETs from Vishay provide the

  designer with the best combination of fast switching,

  ruggedized device design, low on-resistance and

  cost-effectiveness.

  The DPAK is designed for surface mounting using vapor

  phase, infrared, or wave soldering techniques. The straight

  lead version (IRFU/SiHFU series) is for through-hole

  mounting applications. Power dissipation levels up to 1.5 W

  are possible in typical surface mount applications.

fe014管脚功能及技术特性

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