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高密度封装技术推动测试技术发展
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2009-12-14
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高密度封装技术推动测试技术发展
鲜 飞（烽火通信科技股份有限公司,湖北 武汉 430074）
摘要：高密度封装技术的飞速发展也给测试技术提出了新挑战。为了应对挑战，新的测试技术不断涌现。本文主要介绍了几种新型测试技术的特点，并对未来测试技术的发展趋势及方向进行了初步分析。
关键词：集成电路；封装；测试技术；自动光学检测技术；自动X-射线检测
Testing Technology Development Promoted by HDI Packaging Technology
XIAN Fei（Fiberhome Telecommunication Technologies Co.,Ltd, Wuhan 430074,China）
Abstract: The rapid development of high density packaging technology has already bring up the ew challenge to testing technology. For replying challenge, the new testing technology
continuously appears. Characteristics of several advanced testing technology are introduced in the
paper. The up-to-date trends are discussed and the future research directions are suggested.
Key words: IC; Package; Testing Technology; AOI; AXI
鲜 飞（烽火通信科技股份有限公司,湖北 武汉 430074）
摘要：高密度封装技术的飞速发展也给测试技术提出了新挑战。为了应对挑战，新的测试技术不断涌现。本文主要介绍了几种新型测试技术的特点，并对未来测试技术的发展趋势及方向进行了初步分析。
关键词：集成电路；封装；测试技术；自动光学检测技术；自动X-射线检测
Testing Technology Development Promoted by HDI Packaging Technology
XIAN Fei（Fiberhome Telecommunication Technologies Co.,Ltd, Wuhan 430074,China）
Abstract: The rapid development of high density packaging technology has already bring up the ew challenge to testing technology. For replying challenge, the new testing technology
continuously appears. Characteristics of several advanced testing technology are introduced in the
paper. The up-to-date trends are discussed and the future research directions are suggested.
Key words: IC; Package; Testing Technology; AOI; AXI
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