×

Quad Flat Pack No-Lead (QFN)

消耗积分:10 | 格式:rar | 大小:344 | 2010-01-12

分享资料个

This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.

The Application Note is written generically to encompass various Micro Dual And Quad Flat Pack No-lead (uDFN / QFN) packages assembled internally and externally. It should be noted that device specific information is not provided. This document serves only as a guideline to help develop a user specific solution. Actual experience and development efforts are still required to optimize the process per individual device requirements and practices.
The document combines information from two separate studies. When recommendation varies between the two studies, both views are provided and the source noted.

下载并关注上传者 低至0.43元/天 开通VIP 免费下载

声明：本文内容及配图由入驻作者撰写或者入驻合作网站授权转载。文章观点仅代表作者本人，不代表电子发烧友网立场。文章及其配图仅供工程师学习之用，如有内容侵权或者其他违规问题，请联系本站处理。 举报投诉

评论(1)
发评论
raulgu 2012-09-23
0 回复 举报
这个是TI的文档。。失望 收起回复

下载排行榜

全部1条评论

快来发表一下你的评论吧 !