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Cyclone系列器件的热阻
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2009-03-28
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Tables 1 through 6 in this data sheet provide θJA (junction-to-ambient
thermal resistance) and θJC (junction-to-case thermal resistance) values
for Altera® Cyclone® series devices available in Ball-Grid Array (BGA),
FineLine® BGA (FBGA), Micro FineLine BGA® (MBGA), Ultra FineLine
BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC),
Plastic Enhanced Quad Flat Pack (EQFP), Thin Quad Flat Pack (TQFP),
Plastic Quad Flat Pack (PQFP), and Power Quad Flat Pack (RQFP).
For additional packaging information, refer to the Altera Device Packaging
Data Sheet.
thermal resistance) and θJC (junction-to-case thermal resistance) values
for Altera® Cyclone® series devices available in Ball-Grid Array (BGA),
FineLine® BGA (FBGA), Micro FineLine BGA® (MBGA), Ultra FineLine
BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC),
Plastic Enhanced Quad Flat Pack (EQFP), Thin Quad Flat Pack (TQFP),
Plastic Quad Flat Pack (PQFP), and Power Quad Flat Pack (RQFP).
For additional packaging information, refer to the Altera Device Packaging
Data Sheet.
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