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Intersil的高速A D转换器的电路板布置 接地 电源要
消耗积分:5 |
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大小:122 |
2009-06-10
golabs
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Table 1 shows the wide range of high-speed ADC’s available
from Intersil. Maintaining the accuracy of these converters in
a high-speed environment can be quite a challenge. This
note will point out considerations for board layout, grounding,
power management, and suggest various support circuits.
The cost of multilayer boards has decreased to the point
where they are now commonly used with high-speed mixed
signal circuits. This technology enables the use of solid
ground and power planes which will result in the lowest
impedance possible while minimizing any shared impedances.
Figure 1 illustrates the sequencing of the layers used
on the HI1276 evaluation board. The dimensions called out
were those required to achieve 50Ω microstrip for the signal
lines.
from Intersil. Maintaining the accuracy of these converters in
a high-speed environment can be quite a challenge. This
note will point out considerations for board layout, grounding,
power management, and suggest various support circuits.
The cost of multilayer boards has decreased to the point
where they are now commonly used with high-speed mixed
signal circuits. This technology enables the use of solid
ground and power planes which will result in the lowest
impedance possible while minimizing any shared impedances.
Figure 1 illustrates the sequencing of the layers used
on the HI1276 evaluation board. The dimensions called out
were those required to achieve 50Ω microstrip for the signal
lines.
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