OMAP3530 and OMAP3525 high-performance, applications processors are based on the enhanced OMAP™ 3 architecture. The OMAP™ 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:
-
Streaming video
-
2D/3D mobile gaming
-
Video conferencing
-
High-resolution still image
-
Video capture in 2.5G wireless terminals, 3G wireless terminals, and rich multimedia-featured handsets, and high-performance personal digital assistants (PDAs).
The device supports high-level operating systems (OSs), such as:
-
Windows CE
-
Symbian OS
-
Linux
-
Palm OS
This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.
The following subsystems are part of the device:
-
Microprocessor unit (MPU) subsystem based on the ARM Cortex™-A8 microprocessor
-
IVA2.2 subsystem with a C64x+ digital signal processor (DSP) core
-
SGX530 subsystem for 2D and 3D graphics acceleration to support display and gaming effects (3530 only)
-
Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
-
Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out.
-
Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals
The device also offers:
-
A comprehensive power and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex™ adaptative voltage control. This power management technique for automatic control of the operating voltage of a module reduces the active power consumption.
-
Memory stacking feature using the package-on-package (POP) implementation (CBB package only)
OMAP3530/25 devices are available in a 515-pin PBGA package (CBB suffix) and a 423-pin PBGA package (CUS suffix). Some features of the CBB package are not available in the CUS package.
声明:本文内容及配图由入驻作者撰写或者入驻合作网站授权转载。文章观点仅代表作者本人,不代表电子发烧友网立场。文章及其配图仅供工程师学习之用,如有内容侵权或者其他违规问题,请联系本站处理。 举报投诉